Synthesis of Two Coumarins Isolated from <i>Aster praealtus</i>

Wang, Bo; Chen, Huijun; Liu, Bo

doi:10.1002/cjoc.201500295

Cited by 8 publications

(11 citation statements)

References 35 publications

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“…For instance, Zeng et al developed an ice‐templated fabrication method, which produces an ordered 3D honeycomb‐like network ( Figure a). Wang and Wu proposed to fabricate 3D BNNS network via multiple layer‐by‐layer assembly using 3D melamine foam (MF) (Figure b) . Through a two‐step CVD method, Xue et al synthesized a BN cellular architecture made of interconnective nanotubular hBN (Figure c) …”

Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

“…g) Polymer composites with 3D nanostructures, including melamine foam with BN nanosheets assemblies (22, ref. ), 3D BN cellular architecture (23, ref. ), polystyrene composite with 3D segregated double networks (24, ref.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Transport in 3D Nanostructures

Zhan

Nie

Chen

et al. 2019

Adv Funct Materials

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This work summarizes the recent progress on the thermal transport properties of 3D nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or designed to either achieve a low thermal conductivity for thermal insulation or thermoelectric devices or a high thermal conductivity for thermal interface materials used in the continuing miniaturization of electronics. A broad range of 3D nanostructures are discussed, ranging from colloidal crystals/assemblies, array structures, holey structures, hierarchical structures, to 3D nanostructured fillers for metal matrix composites and polymer composites. Different factors that impact the thermal conductivity of these 3D structures are compared and analyzed. This work provides an overall understanding of the thermal transport properties of various 3D nanostructures, which will shed light on the thermal management at nanoscale.

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Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

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Thermal Transport in 3D Nanostructures

Zhan

Nie

Chen

et al. 2019

Adv Funct Materials

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“…In order to improve the thermal conductivity, researchers have made many studies. Currently, most heat dissipation material is based on ceramic, [ 1–4 ] metal, [ 5–11 ] and carbon‐based [ 12–17 ] fillers. Due to its shortcomings such as high price, difficult processing, and poor mechanical properties, exploring high intrinsic thermally conductive polymers has become more attractive.…”

Section: Introductionmentioning

confidence: 99%

High Intrinsic Thermal Conductivity of Polythiophene by Reducing Steric Hindrance and Enhancing p‐π Conjugation

Zheng

et al. 2021

Macro Chemistry & Physics

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A series of copolymers of poly3‐alkylthiophene (PTm) with different side chain lengths and copolymers of 3‐butylthiophene and 3‐butoxythiophene (PTDx) with different ratios are synthesized by oxidative polymerization. As the length of the side chain decreases, WAXD patterns of PTm show an increase in crystallinity. An increment of 50% in thermal conductivity is observed and the maximum thermal conductivity reaches to 0.320 Wm–1K–1. For PTDx, as the proportion of 3‐butoxythiophene increases, the UV spectrum appears red‐shifted, indicating an enhanced degree of p‐π conjugation. The thermal conductivity of PTDx is increased from 0.340 to 0.374 Wm–1K–1, which is around twice that of traditional thermoplastics. Molecular dynamics (MD) is used to simulate the changes in the volume and dihedral angle overlap of the polymer at different temperatures, and achieves the same result as the experiment. MD simulations and experimental measurements have shown that reducing steric hindrance and enhancing p‐π conjugation can increase the thermal conductivity of the polymer. Young's modulus of PTDx (around 1.86 GPa) is lower than that of conventional plastics, and its flexibility makes it more versatile.

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“…[ 8 ] However, epoxy resin generally has very low thermal conductivity in the order of magnitude 0.1 W m −1 K −1 . To improve the thermal conductivity of epoxy resin, a wide variety of thermal conductive fillers, including metals, [ 9 ] ceramics, [ 10–14 ] carbon nanotubes, [ 15 ] grapheme, [ 16 ] and boron nitride, [ 17–20 ] have been extensively used to form composites. However, there may be two undesirable drawbacks by the addition of these fillers in the application of electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Vertically Aligned Al₂O₃ Fiber Framework Leading to Anisotropically Enhanced Thermal Conductivity of Epoxy Composites

Chen

Zhu

et al. 2021

Adv Eng Mater

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With the development of the modern electronic devices, efficient heat removal via thermal management materials in a low filling load has become one of the most critical challenges. Herein, a biomass template method is used to produce 3D alumina skeleton with one‐directionally arranged alumina fibers as the thermal conductive filler of epoxy composites. Thermal conductive composites with anisotropically enhanced thermal conductivity are prepared by impregnating epoxy resin into the 3D alumina skeleton. At an alumina load of 17.7 wt%, the composite exhibits a high out‐of‐plane thermal conductivity of 0.72 W m−1 K−1 (3.27 times of pure epoxy) and an in‐plane thermal conductivity of 0.38 W m−1 K−1, respectively. When compared with literatures in terms of the thermal conductivity enhancement per unit mass of filler, the samples are on the top. By using the biomass template method to construct 3D anisotropic structure, it is effective to improve the out‐of‐plane thermal conductivity of the composites, which exhibits strong potential for thermal management applications.

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Synthesis of Two Coumarins Isolated from Aster praealtus

Cited by 8 publications

References 35 publications

Thermal Transport in 3D Nanostructures

Thermal Transport in 3D Nanostructures

High Intrinsic Thermal Conductivity of Polythiophene by Reducing Steric Hindrance and Enhancing p‐π Conjugation

Vertically Aligned Al₂O₃ Fiber Framework Leading to Anisotropically Enhanced Thermal Conductivity of Epoxy Composites

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Synthesis of Two Coumarins Isolated from Aster praealtus

Cited by 8 publications

References 35 publications

Thermal Transport in 3D Nanostructures

Thermal Transport in 3D Nanostructures

High Intrinsic Thermal Conductivity of Polythiophene by Reducing Steric Hindrance and Enhancing p‐π Conjugation

Vertically Aligned Al2O3 Fiber Framework Leading to Anisotropically Enhanced Thermal Conductivity of Epoxy Composites

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Vertically Aligned Al₂O₃ Fiber Framework Leading to Anisotropically Enhanced Thermal Conductivity of Epoxy Composites