2011
DOI: 10.1002/pat.1898
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Synthesis of mesoporous silica and its modification of bismaleimide/cyanate ester resin with improved thermal and dielectric properties

Abstract: A novel method is proposed to synthesize new mesoporous silica containing amine groups (MPSA), and it was further employed to modify bismaleimide-dialllyl bisphenol (BD)/cyanate ester (CE) resin to form novel MPSA/BD/CE hybrids; in addition, the typical properties of MPSA/BD/CE were systematically investigated. Results show that these hybrids have very low dielectric constant and loss as well as good thermal properties. Compared with BD/CE resin, all hybrids have not only decreased dielectric constant and loss… Show more

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Cited by 16 publications
(7 citation statements)
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“…Better performance of microelectronic is possible not only by the good thermal conductivity polymer composites but along with the desired dielectric property and lower loss tangent (tan (δ)). Composite materials with lower dielectric constant are gaining significant attention by the engineering and scientific society because these materials are having good potential in fast information transfer . In practice, low and high dielectric materials are equally important in electronic and electrical applications.…”
Section: Role and Effect Of Filler/hybrid Filler Addition On Dielectrmentioning
confidence: 99%
See 1 more Smart Citation
“…Better performance of microelectronic is possible not only by the good thermal conductivity polymer composites but along with the desired dielectric property and lower loss tangent (tan (δ)). Composite materials with lower dielectric constant are gaining significant attention by the engineering and scientific society because these materials are having good potential in fast information transfer . In practice, low and high dielectric materials are equally important in electronic and electrical applications.…”
Section: Role and Effect Of Filler/hybrid Filler Addition On Dielectrmentioning
confidence: 99%
“…Composite materials with lower dielectric constant are gaining significant attention by the engineering and scientific society because these materials are having good potential in fast information transfer. 55 In practice, low and high dielectric materials are equally important in electronic and electrical applications. For example, a material with higher dielectric constant can be used as cable insulator 56 in capacitors to store electrical charge; high dielectric constant of a material implies more energy storage in the capacitor, 57 actuators and artificial muscles, 58 and electrocaloric cooling.…”
Section: Role and Effect Of Filler/hybrid Filler Addition On Dielecmentioning
confidence: 99%
“…A strategy used to provide thermooxidative protection in cyanurate polymer networks that has been explored through much recent investigation is the incorporation of silicon or siloxy moieties in the form of monomers and cocuratives, blends and modifiers, silica nanoparticles, clay nanoplatelets, or other silicon‐containing nanostructures including oligomeric silsesquioxanes . While the addition of silicon in fully oxidized form (i.e., as SiO 2 ) can provide an in‐place barrier to oxygen permeation, the use of unoxidized organosilicon moieties or partly oxidized silicates allows for the in situ generation of a protective barrier during high‐temperature oxidation or exposure to energetic forms of oxygen (such as atomic oxygen in low Earth orbit) .…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the dielectric properties of CEs are superior to all other existing thermosetting resins [1][2][3]. All the above advantages permit CEs to be well-suited materials for application in the fabrication of electrical components, aerospace structures, and adhesives, as well as the design of many functional composites [3][4][5]. Nevertheless, CEs also have some disadvantages, such as a high cure temperature and brittle structure, which limits their applications in many fields.…”
Section: Introductionmentioning
confidence: 99%