Synthesis and thermal behavior of Cu/Y2W3O12 composite

Development of designing lightweight composites and structures for tailorable thermal expansion

“…Praveen等人 [29] [30,31] , 因瓦合金 [32] 或铝 [33,34] , 氧化锆陶 瓷 [35,36] , 高分子聚合物 [37,38] 等作为正膨胀基体, 通过 合理配比及相应的制备工艺可以得到零或负膨胀复 合 材料 [39] . 其 他一 些颗粒 增强 复合材 料研 究包括 : Ding 等 人 [40] , Yan 等 人 [41] 分 别 制 备 了 近 零 膨 胀 的 Mn 3 Cu 0.5 A 0.5 N (A=Ni, Sn)/Cu和Mn 3 Cu 0.5 Ge 0.5 N/Cu复 合材料; Liu等人 [42] [43] [44] .…”

Relationship between hygroscopicity reduction and morphology evolution of Y2Mo3O12 doped with (LiMg)3+

“…Both heavy hygroscopicity and high phase transition temperature in A 2 M 3 O 12 (M-W/Mo) family, which possesses stable structure and strong NTE property besides its high trivalent ion conduction [11][12][13][14][15][16][17][18][19], have been investigated widely to satisfy practical applications. The investigations about the hygroscopicity and its reduction of A 2 Mo 3 O 12 with theoretical simulation and experimental method [9,[20][21][22] pointed out that the hygroscopicity affecting the NTE property of A 2 Mo 3 O 12 family is related to the "A" cations size.…”

Fabrication of TiCx-TiB2/Al Composites for Application as a Heat Sink

“…Accordingly, ideal heat sink materials should exhibit superior thermal conductivity (TC) to effectively dissipate the heat generated by the electronic components and high strength and good abrasive wear behavior to protect the electronic components [3,4]. In addition, the heat sink materials also need possess a suitable coefficient of thermal expansion (CTE) to avoid high thermal stresses generated at the boundary between the heat sink and electronic components [5,6]. …”