Fabrication of TiCx-TiB2/Al Composites for Application as a Heat Sink

Shu, Shili; Yang, Hong–Yu; Tong, Cunzhu; Qiu, Feng

doi:10.3390/ma9080642

Cited by 31 publications

(25 citation statements)

References 30 publications

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“…In the past decades, particulate reinforced aluminum matrix composites (AMCs) have attracted much attention in the field of structural and functional materials [1][2][3][4]. SiC p reinforced AMCs have been a hot research issue in recent years because of their excellent properties such as low density, high tensile strength, high elastic modulus and wear resistance, etc.…”

Section: Introductionmentioning

confidence: 99%

Microstructures and Tensile Properties of Al–Cu Matrix Composites Reinforced with Nano-Sized SiCp Fabricated by Semisolid Stirring Process

Qiu

Gao

Tang

et al. 2017

Metals

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Abstract:The nano-sized SiC p /Al-Cu composites were successfully fabricated by combining semisolid stirring with ball milling technology. Microstructures were examined by an olympus optical microscope (OM), field emission scanning electron microscope (FESEM) and transmission electron microscope (TEM). Tensile properties were studied at room temperature. The results show that the α-Al dendrites of the composites were strongly refined, especially in the composite with 3 wt. % nano-sized SiC p , of which the morphology of the α-Al changes from 200 µm dendritic crystal to 90 µm much finer equiaxial grain. The strength and ductility of the composites are improved synchronously with the addition of nano-sized SiC p particles. The as-cast 3 wt. % nano-sized SiC p /Al-Cu composite displays the best tensile properties, i.e., the yield strength, ultimate tensile strength (UTS) and fracture strain increase from 175 MPa, 310 MPa and 4.1% of the as-cast Al-Cu alloy to 220 MPa, 410 MPa and 6.3%, respectively. The significant improvement in the tensile properties of the composites is mainly due to the refinement of the α-Al dendrites, nano-sized SiC p strengthening, and good interface combination between the SiC p and Al-Cu alloys.

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Section: Introductionmentioning

confidence: 99%

Microstructures and Tensile Properties of Al–Cu Matrix Composites Reinforced with Nano-Sized SiCp Fabricated by Semisolid Stirring Process

Qiu

Gao

Tang

et al. 2017

Metals

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“…The heat sink does play an important role in LED and electronic devices. The design of heat sink affects the heat dissipation efficiency [ 39 , 40 ]. Without a good thermal dissipating path, heat may accumulate and may cause a temperature rise in the LED chip.…”

Section: Resultsmentioning

confidence: 99%

High Thermal Dissipation of Al Heat Sink When Inserting Ceramic Powders by Ultrasonic Mechanical Coating and Armoring

et al. 2017

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Aluminum alloys, which serve as heat sink in light-emitting diode (LED) lighting, are often inherent with a high thermal conductivity, but poor thermal total emissivity. Thus, high emissive coatings on the Al substrate can enhance the thermal dissipation efficiency of radiation. In this study, the ultrasonic mechanical coating and armoring (UMCA) technique was used to insert various ceramic combinations, such as Al2O3, SiO2, or graphite, to enhance thermal dissipation. Analytic models have been established to couple the thermal radiation and convection on the sample surface through heat flow equations. A promising match has been reached between the theoretical predictions and experimental measurements. With the adequate insertion of ceramic powders, the temperature of the Al heat sinks can be lowered by 5–11 °C, which is highly favorable for applications requiring cooling components.

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“…The design and structure of microchannels have a significant impact on hydraulic and thermal performance of heatsinks. In the last 50 years, much effort has been devoted to enhance the heat dissipation ability of heatsinks in respect to the heatsink materials and fabrication methods [1][2][3], different arrangements of equipment in cooling loops and systems [4], optimization tools [5], different coolants [6], different phases of coolants [7,8], combination of thermoelectric coolers and heatsinks [9], compact sandwiched press-pack SiC power module [10], using nanofluids [11], heat exchangers designs [12], using porous materials in heatsinks [13] and different channel shapes and designs [14].…”

Section: Introductionmentioning

confidence: 99%

A Modification of Offset Strip Fin Heatsink with High-Performance Cooling for IGBT Modules

2020

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For reliability and thermal management of power devices, the most frequently used technique is to employ heatsinks. In this work, a new configuration of offset strip fin heatsink based on using the concept of curvy fins and U-turn is proposed with the aim of improving the heat transfer performance. With this aim, a three-dimensional model of heatsink with Silicon Insulated-Gate Bipolar Transistors (IGBTs) and diodes, solder, Direct Bonded Copper (DBC) substrate, baseplate and thermal grease is developed. Richardson’s extrapolation is used for increasing the accuracy of the numerical simulations and to validate the simulations. To study the effectiveness of the new offset design, results are compared with conventional offset strip fin heatsink. Results show that in aspects of design of heatsinks (including heat transfer coefficient, maximum chip temperature and thermal resistance), the new introduced model has advantages compared to the conventional offset strip fin design. These enhancements are caused by the combination of the longer coolant passage in the heatsink associated with generation of disturbance and recirculation areas along the curvy fins, creation of centrifugal forces in the U-turn, and periodic breaking up boundary layers. Also, it is shown that due to narrower passage and back-and-forth route, the new introduced design can handle the hot spots better than conventional design.

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Fabrication of TiCx-TiB2/Al Composites for Application as a Heat Sink

Cited by 31 publications

References 30 publications

Microstructures and Tensile Properties of Al–Cu Matrix Composites Reinforced with Nano-Sized SiCp Fabricated by Semisolid Stirring Process

Microstructures and Tensile Properties of Al–Cu Matrix Composites Reinforced with Nano-Sized SiCp Fabricated by Semisolid Stirring Process

High Thermal Dissipation of Al Heat Sink When Inserting Ceramic Powders by Ultrasonic Mechanical Coating and Armoring

A Modification of Offset Strip Fin Heatsink with High-Performance Cooling for IGBT Modules

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