Synergetic enhancement of thermal conductivity by constructing BN and AlN hybrid network in epoxy matrix

Liang, Di; Ren, Penggang; Ren, Fangfang; Jin, Yanling; Wang, Jin; Feng, Chuting; Duan, Qian

doi:10.1007/s10965-020-02193-3

Cited by 32 publications

(13 citation statements)

References 56 publications

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“…Polydimethylsiloxane (PDMS) is often used as the matrix material of thermal interface materials because of its excellent properties, such as flexibility, low cost, chemical inertness, water resistance, and flame retardant [ 10 , 11 , 12 , 13 , 14 ]. However, the intrinsic thermal conductivity of PDMS (about 0.2 W·m −1 ·K −1 ) is not ideal to meet the needs of the electronic industry [ 15 , 16 , 17 , 18 , 19 ]. Therefore, it is necessary to improve the thermal conductivity of PMDS to expand its potential applications.…”

Section: Introductionmentioning

confidence: 99%

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Huang

Drummer

et al. 2021

Polymers

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In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m·K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.

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Section: Introductionmentioning

confidence: 99%

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Huang

Drummer

et al. 2021

Polymers

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“…In addition, the viscosities obtained for the different EP composites at maximum filler loading were as follows: m-Al 2 O 3 /EP 80 wt.% (424 Pa·s), n-Al 2 O 3 /EP 60 wt.% (503 Pa·s), BN/EP 40 wt.% (217 Pa·s), and m-Al 2 O 3 –BN/EP 80 wt.% (1069 Pa·s). It was observed from the results that the viscosity is influenced by the particle size, particle shape, and amount of filler content [ 15 , 36 , 37 , 38 , 39 ]. The BN composites started exhibiting a prompt increase in viscosity at low filler content, which was related to their flake-like particle shape.…”

Section: Resultsmentioning

confidence: 99%

“…Figure 6 a displays the thermal conductivity variations of the different composites as a function of filler content. In general, for all cases, the thermal conductivity increased with filler loading, and it was noted that the thermal conductivity is affected by the particle size and shape of filler particles [ 1 , 7 , 15 , 19 , 36 , 37 , 40 , 41 , 42 , 43 , 44 ]. The epoxy binder system exhibited a very low thermal conductivity of 0.22 W·m −1 ·K −1 .…”

Section: Resultsmentioning

confidence: 99%

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

et al. 2021

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In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.

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“…Due to the perfect dispersion of BN and AlN, more phonon pathways created in the composites which substantially enhanced the thermal conductivity of epoxy composite (eight times more than the neat epoxy and two times more than single BN or AlN filling composite). [ 48 ] Wang et al studied the effect of using hybrid fillers on the polybenzoxazine composites' thermal conductivity. Wang et al introduced BN and CNT as hybrid fillers in the polybenzoxazine matrix.…”

Section: Introductionmentioning

confidence: 99%

Rheological, thermal, and electrical characterization polyamide/polypropylene blend composites containing hybrid filler: Boron nitride and reduced graphene oxide

et al. 2021

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In this study, the microstructural development and its effect on the thermal conductivity of polyamide6 (PA6)/polypropylene (PP) blends containing boron nitride (BN) and reduced graphene oxide (rGo) as hybrid fillers were investigated. Blend samples were prepared using the masterbatch method to localize BN and rGo in the matrix phase (PA6). Dynamic rheological results were consistent with selective localization of the fillers in PA6 as evidenced by nonterminal behavior (3D network) PP/PA-BN at low frequencies. Compared with the case where the matrix phase (PA6) was only filled with BN particles, thermal conductivity measurements showed that replacing 10% and 15% BN particles with rGo nanoparticles yielded higher thermal conductivity. The hybrid fillers had a synergetic effect on the heat conductive network, forming a more efficient percolating network of BN and rGo in the matrix phase (PA6). A comparison between the BN-filled PA6 blend and the BN-rGo-filled PA6 blend revealed higher thermal conductivity in the PP/PA6-BN-rGo sample with co-continuous morphology than in the PP/PA6-BN sample with matrix-disperse morphology.

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Synergetic enhancement of thermal conductivity by constructing BN and AlN hybrid network in epoxy matrix

Cited by 32 publications

References 56 publications

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

Rheological, thermal, and electrical characterization polyamide/polypropylene blend composites containing hybrid filler: Boron nitride and reduced graphene oxide

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