Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Abstract

In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m·K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.

Specifics of Thermal Transport in Graphene Composites: Effect of Lateral Dimensions of Graphene Fillers

“…In Figure , the symbols show the extracted experimental thermal conductivity as a function of the graphene loading fraction for three examined graphene filler sizes and its comparison with theoretical modeling (dashed lines). The measured thermal conductivity of the base polymer matrix–silicone oil was 0.17 Wm –1 K –1 which agrees with the previously reported values. ,− The thermal conductivity is higher for the large filler size TIMs at all the measured loading fractions. We rationalize this trend by comparing the size of the graphene fillers with the average, also referred to as gray phonon MFP in graphene.…”

Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method

“…Due to the low thermal conductivity of polymer packaging materials, the thermal conductivity of the polymer is usually improved by adding high thermal conductivity fillers. The filler-filled thermal conductive polymer materials are mainly prepared by adding high thermally conductive metal materials (such as copper powder, , silver powder, − metal sheet, and wire − ), carbon materials (such as carbon fiber, − graphene, − graphite, − carbon nanotube, − and carbon black − ) or high thermal conductive inorganic fillers (such as aluminum nitride, , boron nitride, − silicon nitride, , silicon carbide, − magnesium oxide, , silicon oxide, alumina, − barium titanate, and zinc oxide) and other high thermal conductivity fillers (such as MXene − ). Filler-filled thermal conductive polymer composites have the advantages of a simple preparation method, low cost, suitable types of polymers, and fillers.…”

Attapulgite–MXene Hybrids with Ti3C2Tx Lamellae Surface Modified by Attapulgite as a Mechanical Reinforcement for Epoxy Composites

“…In addition to changing the surface functional groups of the reinforcement, another promising strategy is to use a hybrid filler composed of two or more filler materials [ 31 , 32 , 33 ], such as grafting a 1D material onto the surface of a 2D material to obtain a hybrid filler. From a practical point of view, the more accessible 1D materials and the lower the cost, the easier it is to realize applying the hybrid-reinforced polymer.…”