Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration

Sun, Fengda; Leblebici, Yusuf; Brunschwiler, Thomas

doi:10.1109/ectc.2011.5898656

Cited by 6 publications

(1 citation statement)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…One self-alignment technique uses surface tension of the solder ball itself [10], as well as the surface tension of water [11] and flux [12]. Although these techniques are good alternative self-alignment technologies for applications that require the use of solder interconnections, complexities are introduced to ensure that the accurate alignment is achieved consistently; clean dicing, chip leveling, and precise volume control are some examples of the factors that must be carefully controlled.…”

Section: A Overview Of the Self-alignment Mechanismmentioning

confidence: 99%

Self-Aligned Silicon Interposer Tiles and Silicon Bridges Using Positive Self-Alignment Structures and Rematable Mechanically Flexible Interconnects

Yang

Zhang

Bakir

2014

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

A novel large-scale silicon system platform is proposed and demonstrated. In this paper, three silicon interposer tiles are aligned and mounted on a printed wiring board (PWB), and two silicon bridges are aligned and mounted on top of the three interposer tiles; each silicon bridge spans two interposer tiles. Four positive self-alignment structures and four inverted pyramid pits self-align a tile to the PWB and a bridge to two tiles. Mechanically flexible interconnects (MFI) form nonbonding electrical connections between the three interposer tiles and two silicon bridges; MFIs are fabricated on the interposer tiles. Pointy tips on the MFIs form low contact resistance with the pads on the silicon bridges. Less than 4 µm alignment error is demonstrated on a stack of silicon substrates, and <8 µm alignment error between a silicon bridge and tiles is also demonstrated on a FR4 substrate. Daisy chain and four-point measurements are performed to verify electrical connections between the three interposer tiles via MFIs and silicon bridges.

show abstract

Section: A Overview Of the Self-alignment Mechanismmentioning

confidence: 99%