2008
DOI: 10.1063/1.2857465
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Surface passivation and heterojunction cells on Si (100) and (111) wafers using dc and rf plasma deposited Si:H thin films

Abstract: The structure of hydrogenated silicon (Si:H) films deposited by rf and dc plasma process on Si (100) and (111) wafers is correlated with the surface passivation quality and heterojunction cell performance. Microstructural defects associated with SiH2 bonding and apparent ion bombardment in dc plasmas have little or no adverse effect on passivation or cell properties, while presence of crystallinity in Si:H i layer severely deteriorates surface passivation and cell open circuit voltage (Voc). Excellent surface … Show more

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Cited by 112 publications
(77 citation statements)
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“…7 In other words, a high level of hydrogenation of the c-Si surface is desired. 7 This is most often achieved during the deposition of the a-Si:H layers, which is typically done by PECVD and usually at low pressures, 28 although it has been shown that high pressures can yield good passivation as well. 29,30 Additionally, post-deposition annealing is frequently employed as a tool to further relax the a-Si:H nanostructure and accommodate migration of atomic Published by AIP Publishing.…”
Section: Introductionmentioning
confidence: 99%
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“…7 In other words, a high level of hydrogenation of the c-Si surface is desired. 7 This is most often achieved during the deposition of the a-Si:H layers, which is typically done by PECVD and usually at low pressures, 28 although it has been shown that high pressures can yield good passivation as well. 29,30 Additionally, post-deposition annealing is frequently employed as a tool to further relax the a-Si:H nanostructure and accommodate migration of atomic Published by AIP Publishing.…”
Section: Introductionmentioning
confidence: 99%
“…122, 035302-1 H from the bulk of the a-Si:H towards the a-Si:H/c-Si interface. 28,31 Therefore, a sufficiently high hydrogen content in the film is generally preferred. 32 Secondly, the lowest defect density and best surface passivation is typically obtained by preparing dense a-Si:H films close to the amorphous-tocrystalline transition, while making sure that the film maintains fully amorphous.…”
Section: Introductionmentioning
confidence: 99%
“…6 The passivation of the crystalline silicon ͑c-Si͒ wafer surfaces is usually performed by very thin intrinsic amorphous silicon ͑a-Si:H͒ layers, deposited by rf plasma-enhanced chemical vapor deposition ͑PECVD͒ ͑Refs. 2, 3, and 5͒ or similar methods ͓direct-current PECVD, 3 hot-wire CVD ͑Ref. 4͔͒.…”
mentioning
confidence: 99%
“…Silicon heterojunction solar cells have a high conversion efficiency potential, [1][2][3][4][5] up to 23% to date. 6 The passivation of the crystalline silicon ͑c-Si͒ wafer surfaces is usually performed by very thin intrinsic amorphous silicon ͑a-Si:H͒ layers, deposited by rf plasma-enhanced chemical vapor deposition ͑PECVD͒ ͑Refs.…”
mentioning
confidence: 99%
“…In this scenario, the silicon heterojunction (SHJ) solar cell technology could be a suitable choice for the photovoltaic industry. The hydrogenated amorphous silicon (a-Si:H) layers involved in SHJ devices can be deposited at temperatures below 300 ºC, typically by Plasma Enhanced Chemical Vapor Deposition (PECVD) [3]. There are also good alternatives to obtain high quality transparent conductive oxide (TCO) layers and metallic electrodes at similarly low temperatures [4], [5].…”
Section: Introductionmentioning
confidence: 99%