The microstructure and electronic structure of epitaxially grown GaN, that has been subjected to high-dose Si implantation, is studied using x-ray absorption fine structure (XAFS) spectroscopy. More specifically, XAFS is used to probe the formation of N–Si bonds and to study the implantation induced distortions in the lattice. The analysis of the extended XAFS spectra reveals that implantation with 100keV Si ions with a fluence equal to 1×1018cm−2 renders the material amorphous and promotes the formation of Si–N bonds with a bond length equal to that corresponding in Si3N4. In addition to that, the N–Ga distances increase by ∼5% due to the lattice expansion caused by the incorporation of the Si ions and the formation of point and extended defects. The absence of long or midrange order is also verified by the near edge XAFS (NEXAFS) spectra where the characteristic peaks are smeared out. However, a characteristic sharp resonance line, that appears about 1eV above the absorption edge, indicates the existence of defect states which are strongly localized on the N atoms, most probably defect complexes involving N dangling bonds. In order to provide additional evidence on the nature of the implantation induced changes we resorted to simulations of the NEXAFS spectra using the FEFF8 code by applying chemical and lattice deformations in the immediate environment of the absorbing atom as well as to larger clusters.