AlN (aluminium nitride) films were prepared by metalorganic chemical vapor deposition (MOCVD) on c-plane sapphire (α-Al 2 O 3 ) substrates. By means of studying the traces of in-situ optical reflectivity, it was found that the AlN nucleation layer showed a specific (0001) lattice orientation, which differed from the GaN nucleation layer on (0001) sapphire substrates. The AlN buffer suffered the compressive stress at the initial stage of nucleation. And the compressive strain was relaxed gradually along with the thickness of buffer increasing and consequently annealing. Optical transmission spectra revealed that in the process of growing AlN epilayers, higher V/III ratio could improve the crystal quality but reduce the growth rates. In addition, proper doping of silane (SiH 4 ) could improve the surface morphology of AlN film.AlN, MOCVD, optical reflectivity, XRD, optical transmission spectra As a wide band gap semiconductor material, AlN has great potential for applications in ultraviolet (UV) light emitting diodes (LEDs) and laser diodes (LDs), high temperature/frequency electronic devices, and GHz-band surface acoustic wave (SAW) devices. Therefore, a great interest in the preparation of high quality single-crystal AlN film has arisen recently. Today, methods for preparing AlN film include plused-laser deposition (PLD), rf sputtering, molecular beam epitaxy (MBE), and metalorganic chemical vapor deposition (MOCVD). However, high quality of AlN films are hard to obtain due to low diffusion velocity of adsorbed Al atoms and intense parasitic reactions during the high temperature growth [1][2][3] .In this paper, we deposited AlN film on c-plane sapphire substrates using the two-step method by MOCVD. The evolution of nucleation and stress of AlN buffer layer was analyzed. Furthermore, the influences of Si doping and V/III ratio to the quality of AlN film were studied.