Surface and adhesion properties of poly(imide-siloxane) block copolymers

Novák, Igor; Sysel, Petr; Zemek, J.; Špírková, Miléna; Velič, Dušan; Aranyosiova, M.; Florián, Š.; Pollák, V.; Kleinová, Angela; Lednický, F.; Janigová, Ivica

doi:10.1016/j.eurpolymj.2008.09.041

Cited by 35 publications

(19 citation statements)

References 22 publications

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“…In the same time the PDMS segments can migrate to the copolymer surface to form domains called island in the see-island structure, because their glass transition temperature is much lower than the room temperature. 13 The surfaces of hybrid films PI-10, PI-20, and PI-30 showed RMS roughness values of 9.4, 18.4, and 40.1 nm, respectively, over an area of 5×5 µm 2 . As it can be seen in Figure 2(c-f) the bright domains in polymer are the microphaseseparated areas due to the presence of PDMS segments and silica particles embedded in the composite surface.…”

Section: Resultsmentioning

confidence: 98%

“…They have become potential candidates for applications in microelectronic, printed circuit, gas-permeable membranes, adhesives and aerospace industry. [7][8][9][10][11][12][13] Organic/inorganic hybrid materials have received much attention due to their wide range of multifunctional properties. They combine the advantage of organic component, such as flexibility, low dielectric constant and processability, and of inorganic component, such as rigidity, durability and thermal stability.…”

Section: Introductionmentioning

confidence: 99%

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Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Hamciuc¹,

Hamciuc²,

Okrasa

2011

Macromol. Res.

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Hybrid films containing silica were prepared using a poly(amic acid) incorporating polydimethylsiloxane segments and tetraethoxysilane via a sol-gel technique and thermal cyclodehydration. The surface morphology of the films was examined by atomic force microscopy and scanning electron microscopy. The free surface energy was evaluated based on contact angle measurements. The films were flexible and showed good mechanical properties. They exhibited high thermal stability with an initial decomposition temperature above 420 o C and a glass transition temperature in the range of 216-223 o C. Dielectric spectroscopy revealed primary α 1 relaxation due to the polydimethylsiloxane segments, and three subglass transitions: γ, β 1 and β 2 . At higher temperatures, α 2 -relaxation that corresponds to the upper glass transition and a conductivity process appeared. The influence of the silica content on the hybrid film properties was examined. Dynamic mechanical analysis revealed similar relaxation processes to those observed by dielectric spectroscopy.

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Section: Resultsmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Hamciuc¹,

Hamciuc²,

Okrasa

2011

Macromol. Res.

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“…The low water uptakes of the copolymers were attributed to the hydrophobicity of siloxane, which dominated the surface of the copolymer films. 12,33 Conclusions In this study, a series of new poly(imide siloxane) block copolymers with constant hard segment length but different soft segment lengths were prepared by reacting two different diamines, ODA and APPS, separately with m-TDPA. The copolymers exhibited excellent solubility and low water uptakes.…”

Section: Water Uptakesmentioning

confidence: 99%

Preparation and characterization of poly(imide siloxane) block copolymers based on diphenylthioether dianhydride isomer mixtures

Pei

Chen

Fang

2011

High Performance Polymers

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A series of poly(imide siloxane) block copolymers were prepared based on diphenylthioether dianhydride isomer mixtures (m-TDPA), 4,4 0 -oxydianiline (ODA) and bis(g-aminopropyl)polydimethylsiloxane (APPS). The ODA and m-TDPA composed the hard segment, while the APPS and m-TDPA composed the soft segment. The hard segment length was kept constant, while the soft segment lengths were varied with varying the APPS contents. The copolymers had inherent viscosities range from 0.37 to 0.51 dL g À1 , and their weight-average molecular weights and number-average molecular weights were in the range of 45 000-52 600 and 21 300-27 000, respectively. All copolymers were readily soluble in many organic solvents, and could afford flexible films via solution casting. The cast films exhibited mechanical properties with tensile strengths at break of 26.7-86.2 MPa, elongations at break of 9.9-112.2%, and tensile moduli of 0.12-2.15 GPa, depending on the soft segment length. The films also exhibited low water uptakes in the range of 0.18-0.68 wt.%. Furthermore, the copolymers showed high glass transition temperatures derived from the hard segments in the range of 196-225 C, and good thermal stability with almost no weight loss up to 350 C under nitrogen atmosphere and 335 C under air atmosphere.

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“…[7][8][9] So, PI can be synthesized by introducing different groups to incorporate diverse properties as per the requirements of different fields. 6,9,[12][13][14][15] Novak et al 3,[15][16][17] studied the correlation between surface structure of poly(imide-siloxane) block copolymer and its adhesive property. Excellent adhesive properties, high impact resistance, low dielectric constants, and favorable overall thermal and mechanical properties have led to poly(imide-siloxane) (PIS) copolymers being noticeable and potential branch of novel polyimides and widely studied in the applications of high-performance adhesives and coatings, but their films adhesions to metal are rarely reported.…”

Section: Introductionmentioning

confidence: 99%

Factors influencing thermal, mechanical, optical, and adhesive properties of segmented poly(imide siloxane) copolymers films

Zhao

Chen

et al. 2019

J of Applied Polymer Sci

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Poly(imide siloxane), block and blend copolymer, were synthesized using different methods to explore the influence of siloxane chains. The flexible siloxane chains enrichment on surface of copolymer, enhance hydrophobic and adhesive with copper foil. It also improves light transmittance of polyimide film in the visible light region. The effect of different preparation methods on the aggregation in polymers and on polymer properties, especially adhesion and water absorptivity, are also discussed. The imidization temperature and synthesis method (blend and block) during the reaction has a significant effect on the properties of the product, especially thermal properties (T g values are 207 C for block and 180 C for blend) and mechanical properties (elongation of 130% for block and 50% for blend). The bonding strength of polymer films used as hot melt adhesive was also tested.

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Surface and adhesion properties of poly(imide-siloxane) block copolymers

Cited by 35 publications

References 22 publications

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Preparation and characterization of poly(imide siloxane) block copolymers based on diphenylthioether dianhydride isomer mixtures

Factors influencing thermal, mechanical, optical, and adhesive properties of segmented poly(imide siloxane) copolymers films

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