Superior thermal stability of coherent twin boundaries in nanotwinned metals

Zhang, X.; Misra, Amit

doi:10.1016/j.scriptamat.2012.01.026

Cited by 179 publications

(95 citation statements)

References 46 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Such a limited height step or the tip of a thin twin has been observed in atomistic simulations [50,51,88] and experiments [63,65]. Figure 12 is a plot of the variation of PB or BP step/facet heights in Mg and Co [60,[62][63][64][65]93,94]. Significantly, many have heights other than the stress-free height: they have Burgers vector content.…”

Section: Twin Shapementioning

confidence: 82%

Interface structures and twinning mechanisms of twins in hexagonal metals

Gong

Hirth

Liu

et al. 2017

Materials Research Letters

View full text Add to dashboard Cite

A controversy concerning the description of {1012} 1011 twinning, whether it is shear-shuffle or pure glide-shuffle or pure shuffle, has developed. There is disagreement about the interpretation of transmission electron microscopic observations, atomistic simulations and theories for twin growth. In this article, we highlight the atomic-level, characteristic, equilibrium and non-equilibrium boundaries and corresponding boundary defects associated with the threedimensional 'normal', 'forward' and 'lateral' propagation of {1012} growth/annealing and deformation twins. Although deformation twin boundaries (TBs) after recovery exhibit some similarity to growth/annealing TBs because of the plastic accommodation of stress fields, there are important distinctions among them. These distinctions distinguish among the mechanisms of twin growth and resolve the controversy. In addition, a new type of disconnection, a glide disclination, is described for twinning. Synchroshear, seldom considered, is shown to be a likely mechanism for {1012} twinning. IMPACT STATEMENTA controversy concerning {1012} 1011 twinning in hcp metals has developed. We present comprehensive understanding of interface structures and twinning mechanisms of {1012} growth/annealing and deformation twins at the atomic level. ARTICLE HISTORY

show abstract

Section: Twin Shapementioning

confidence: 82%

Interface structures and twinning mechanisms of twins in hexagonal metals

Gong

Hirth

Liu

et al. 2017

Materials Research Letters

View full text Add to dashboard Cite

show abstract

“…N anotwinned (nt) metals stirred significant interest lately because S3{111} coherent twin boundaries (CTBs) contribute to high strength and ductility [1][2][3][4][5][6][7] , enhanced electrical conductivity 8 and superior thermal stability 9 . Plastic deformation mechanisms have been intensively studied in nt metals with face-centered cubic structure.…”

mentioning

confidence: 99%

In situ nanoindentation study on plasticity and work hardening in aluminium with incoherent twin boundaries

et al. 2014

Self Cite

View full text Add to dashboard Cite

Nanotwinned metals have been the focus of intense research recently, as twin boundaries may greatly enhance mechanical strength, while maintaining good ductility, electrical conductivity and thermal stability. Most prior studies have focused on low stacking-fault energy nanotwinned metals with coherent twin boundaries. In contrast, the plasticity of twinned high stacking-fault energy metals, such as aluminium with incoherent twin boundaries, has not been investigated. Here we report high work hardening capacity and plasticity in highly twinned aluminium containing abundant S3{112} incoherent twin boundaries based on in situ nanoindentation studies in a transmission electron microscope and corresponding molecular dynamics simulations. The simulations also reveal drastic differences in deformation mechanisms between nanotwinned copper and twinned aluminium ascribed to stacking-fault energy controlled dislocation-incoherent twin boundary interactions. This study provides new insight into incoherent twin boundary-dominated plasticity in high stacking-fault energy twinned metals.

show abstract

“…These microstructural characteristics are desirable, and believed to be essential in reducing thermo-mechanical stresses in multi-material systems such as microelectronic interconnects without degrading electrical properties of the material. 6,7,9,28,29 …”

Section: Methodsmentioning

confidence: 99%

The Impact of Organic Additives on Copper Trench Microstructure

Marro

Okoro

Obeng

et al. 2017

J. Electrochem. Soc.

View full text Add to dashboard Cite

Organic additives are typically used in the pulse electrodeposition of copper (Cu) to prevent void formation during the filling of high aspect ratio features. In this work, the role of bath chemistry as modified by organic additives was investigated for its effects on Cu trench microstructure. Polyethylene glycol (PEG), bis(3-sulfopropyl) disulfide (SPS), and Janus green b (JGB) concentrations were varied in the Cu electrodeposition bath. Results indicated a correlation between the JGB/SPS ratio and the surface roughness and residual stresses in the Cu. Electron backscattering diffraction (EBSD) and transmission Kikuchi diffraction (TKD) were used to study the cross-sectional microstructure in the trenches. Finer grain morphologies appeared in trenches filled with organic additives as compared to additive-free structures. Cu trench (111) texture also decreased with increasing organic additive concentrations due to more pronounced influence of sidewall seed layers on trench features. Twin density in the microstructure closely tracked calculated stresses in the Cu trenches. A comprehensive microstructural analysis was conducted in this study, on an area of focus that has garnered little attention from the literature, yet can have a major impact on microelectronic reliability.

show abstract

Superior thermal stability of coherent twin boundaries in nanotwinned metals

Cited by 179 publications

References 46 publications

Interface structures and twinning mechanisms of twins in hexagonal metals

Interface structures and twinning mechanisms of twins in hexagonal metals

In situ nanoindentation study on plasticity and work hardening in aluminium with incoherent twin boundaries

The Impact of Organic Additives on Copper Trench Microstructure

Contact Info

Product

Resources

About