Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon

Chen, Xiao; Liu, Changlin; Ke, Jinyang; Zhang, Jianguo; Shu, Xuewen; Xu, Jianfeng

doi:10.1016/j.matdes.2020.108524

Cited by 72 publications

(23 citation statements)

References 34 publications

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“…Furthermore, simulations with different cutting temperature are conducted to reveal the effect of thermal assistant on cutting mechanism. The cutting temperature is increased from 300 to 1200 K, which is realizable during TAC like laser assisted machining [4,11].…”

Section: Details Of the Cutting Modelmentioning

confidence: 99%

“…During micro-milling process, machininginduced interior type edge chipping defects can be generated in workpiece [3]. In single-crystal diamond cutting (SPDT) machining, a damaged layer ranges from 200 to 600 nm can be formed depending on processing parameters [4,5]. Although the subsurface damage layer can be decreased to about 50 nm by grinding and polishing.…”

Section: Introductionmentioning

confidence: 99%

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Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu

Chu

et al. 2021

Nanoscale Res Lett

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In this paper, molecular dynamics simulations are carried out to investigate the cutting mechanism during the hybrid machining process combined the thermal and vibration assistants. A modified cutting model is applied to study the material removal behavior and subsurface damage formation in one vibration cycle. The results indicate that during the hybrid machining process, the dominant material removal mechanism could transform from extrusion to shearing in a single vibration cycle. With an increase of the cutting temperature, the generation and propagation of cracks are effectively suppressed while the swelling appears when the dominant material removal mechanism becomes shearing. The formation mechanism of the subsurface damage in one vibration cycle can be distinct according to the stress distribution. Moreover, the generation of the vacancies in workpiece becomes apparent with increasing temperature, which is an important phenomenon in hybrid machining process.

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Section: Details Of the Cutting Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu

Chu

et al. 2021

Nanoscale Res Lett

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“… Due to the limitation of the length and time scales, MD methods still could not fully describe the experimental process quantitatively. In some studies combining experiments and MD simulations, MD simulation approach could only qualitatively explain the experimental phenomena [ 19 , 20 , 94 ]. In particular, for some time-dependent materials such as amorphous polymers, the velocity of the probe has a significant impact on the removal state of polymers.…”

Section: Future Research Directions and Challengesmentioning

confidence: 99%

Molecular Dynamics Study on Tip-Based Nanomachining: A Review

et al. 2020

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Tip-based nanomachining (TBN) approaches has proven to be a powerful and feasible technique for fabrication of microstructures. The molecular dynamics (MD) simulation has been widely applied in TBN approach to explore the mechanism which could not be fully revealed by experiments. This paper reviews the recent scientific progress in MD simulation of TBN approach. The establishing methods of the simulation model for various materials are first presented. Then, the analysis of the machining mechanism for TBN approach is discussed, including cutting force analysis, the analysis of material removal, and the defects analysis in subsurface. Finally, current shortcomings and future prospects of the TBN method in MD simulations are given. It is hopeful that this review can provide certain reference for the follow-up research.

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“…Langan et al [ 11 ] study the laser parameter effects of In-LAT machining on residual stress and phase purity of monocrystalline silicon. Chen et al [ 12 ] also analyze monocrystalline silicon subsurface damage and phase transformation caused by In-LAT through tapper cutting experiment and molecular dynamic simulation. Langan et al [ 13 ] prove the in-process laser heating can reduce the residual stress of sapphire surface finishing and further demonstrating the applicability of the In-LAT method on nominally transparent brittle materials.…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigation on Laser Assisted Diamond Turning of Binderless Tungsten Carbide by In-Process Heating

2020

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Binderless tungsten carbide (WC) finds widespread applications in precision glass molding (PGM). Grinding and polishing are the main processes to realize optical surface finish on binderless WC mold inserts. The laser assisted turning (LAT) by in-process heating is an efficient method to enhance the machinability of hard and brittle materials. In this paper, laser heating temperature was pre-calculated by the finite element analysis, and was utilized to facilitate laser power selection. The effects of rake angle, depth of cut, feed rate, and laser power are studied experimentally using the Taguchi method. The variance, range, and signal-to-noise ratio analysis methods are employed to evaluate the effects of the factors on the surface roughness. Based on the self-developed LAT system, binderless WC mold inserts with mirror finished surfaces are machined using the optimal parameters. PGM experiments of molding glass lenses for practical application are conducted to verify the machined mold inserts quality. The experiment results indicate that both the mold inserts and molded lenses with the required quality are achieved.

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Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon

Cited by 72 publications

References 34 publications

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Molecular Dynamics Study on Tip-Based Nanomachining: A Review

Experimental Investigation on Laser Assisted Diamond Turning of Binderless Tungsten Carbide by In-Process Heating

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