Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu, Changlin; He, Wenbin; Chu, Jianning; Zhang, Jianguo; Chen, Xiao; Xiao, Junfeng

doi:10.1186/s11671-021-03526-x

Cited by 20 publications

(6 citation statements)

References 63 publications

(71 reference statements)

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“…The deepest position of the damage is located below the abrasive, which means that the amorphous structure damage generated by the extrusion partly recrystallizes after the polishing. The recovery of generated damage was also reported by Xu et al [53].…”

Section: The Polishing Processsupporting

confidence: 80%

Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

Yin

Zhu

et al. 2021

Tribol Lett

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In the present study, molecular dynamics (MD) simulations are applied to investigate the polishing process of cubic silicon carbide (3C-SiC) with a rotating abrasive. The influence of abrasive rotational speed and rotation axis orientation on the friction characteristics and deformation behaviors of 3C-SiC is studied. The results show that as the rotational speed increases, the normal force first increases until it reaches its maximum at 25 rad/ns and then decreases. The evolution of transverse force with the rotational speed is more complicated and the smallest transverse force and friction coefficient are obtained at the rotational speed of 50 rad/ns. Besides, the transverse force increases while the normal force decreases with the rotation angle when the angular velocity vector of the rotational abrasive is parallel to the substrate surface. The case when the rotational speed is 25 rad/ns and the rotation angle is 0 is a significant critical situation. At the critical situation, we observe the lowest material removal rate, the deepest subsurface damage layer, the biggest high stress region and the smallest high temperature region for all rotational speeds and rotation axis orientations. Moreover, in the simulations, phase transformation (mainly amorphization) induced by high pressure is more pronounced than that by thermal effect. The results gained can shed light on the atomic-scale material removal and deformation mechanisms of 3C-SiC during polishing process.

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Section: The Polishing Processsupporting

confidence: 80%

Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

Yin

Zhu

et al. 2021

Tribol Lett

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“…The hybrid machining technology could effectively inhibit subsurface damage. Molecular dynamics simulation in the in-situ laser and vibration hybrid assisted cutting of single crystal silicon have been carried out by Liu et al [185] through a modified molecular dynamics model, as shown in figure 22. They found that the introduction of the thermal field further reduced the cutting force based on UVC, and the thermal field could suppress the pull-off and cracking generated in UVC.…”

Section: Laser and Ultrasonic Vibration Assisted Cuttingmentioning

confidence: 99%

Field-assisted machining of difficult-to-machine materials

Zhang,

Zheng,

Huang

et al. 2024

Int. J. Extrem. Manuf.

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Difficult-to-machine materials (DMMs) are extensively applied in critical fields such as aviation, national defense, biomedicine, and other key fields due to their excellent material properties. However, traditional machining technology is difficult to precisely machine DMMs due to poor surface quality and low processing efficiency. In recent years, as a new generation of machining technology, field-assisted machining (FAM) technology based on innovative principles such as laser heating, tool vibration, magnetic magnetization, and plasma modification provides a new solution for improving the machinability of DMMs. It is advantageous to prevent the shortcomings of traditional machining methods, and has become a hot topic of research in the domain of ultra-precision machining of DMMs. Many new methods and principles have been presented and investigated one after another, yet few researches have been analysed and summarized from a comprehensive standpoint. To fill this gap and understand the development trend of FAM, this study provides an important overview of FAM, covering different assisted machining methods, application effects, mechanism analysis, and equipment design. The current deficiencies and future challenges of FAM are summarized to lay the foundation for the further development of multi-field hybrid assisted and intelligent field-assisted machining technologies.

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“…The Bridge Domain cross-scale transfer method (BD) was introduced. [19][20][21][22] Molecular dynamics theory was used to describe the selected area on the flank of the cutter tooth. And Lagrange method was used to describe the unselected area of flank of cutter tooth.…”

Section: Super-cell Model and Its Failure Criterion Of The Feature Po...mentioning

confidence: 99%

Cross-scale identification for friction and wear boundaries of tooth flank of high-feed milling cutter

Jiang

Jia

Zhao

et al. 2022

Advances in Mechanical Engineering

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In the milling process, under the high-efficiency and intermittent cutting loads, the instantaneous posture of the milling cutter and the instantaneous cutter-workpiece engagement are in an unstable state. It is difficult to accurately identify the friction and wear boundary of the cutter tooth flank. It has become an urgent problem to be solved in the life evaluation of milling cutters. The characteristics of the instantaneous posture variation of the milling cutter and the distribution of the thermal-stress mechanical coupling field of the flank of cutter tooth under the vibration were studied. Using the cross-scale load transfer method, the cross-scale relationship between the macro and micro friction loads on the cutter tooth flank was realized. The number of broken valence bonds, the sudden change of potential energy and the attenuation of elastic modulus of the super-cell on the flank of cutter tooth were studied. The mesoscopic scale identification method of the friction and wear boundary feature points of the tooth flank was proposed. The instantaneous and cumulative boundary distribution of friction and wear on the flank of cutter tooth were obtained, and verified by experiments.

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Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Cited by 20 publications

References 63 publications

Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

Field-assisted machining of difficult-to-machine materials

Cross-scale identification for friction and wear boundaries of tooth flank of high-feed milling cutter

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