Substrate integrated image guide (SIIG)-a planar dielectric waveguide technology for millimeter-wave applications

Patrovsky, A.; Wu, Ke

doi:10.1109/tmtt.2006.875461

Cited by 71 publications

(26 citation statements)

References 15 publications

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“…We have proposed and developed the concept of substrate integrated circuits (SICs) [35]- [45], which can be effectively used for both electrical and optical waveguide structures. The basic principle of the SICs is to design or synthesize the usually conventional non-planar structures in the form of "planar circuits" so that the planar and "non-planar" structures can be made onto single substrates at low cost with the existing processing or manufacturing techniques.…”

Section: Low-cost Substrate Integrated Circuits For Mmw Rof Applicmentioning

confidence: 99%

Radio-Frequency and Millimeter-Wave Photonic Techniques for Broadband Communications and Sensor Networks

Yao

Zhang

Kashyap³

et al. 2006

2006 Optics Valley of China International Symposium on Optoelectronics

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Recent advances in radio-frequency (RF) and millimeter-wave (mmW) photonics are reviewed with emphasis on our research in broadband radio-over-fiber system architectures, photonic generation and processing of RF and mmW signals, and optoelectronic device design for mmW photonics applications. Future system design challenges are also discussed. In particular, the concept of substrate integrated circuits (SICs) is shown to have great potentials in the design of highly integrated mmW circuits as well as traveling-wave optoelectronic devices, which are critical to the development of future RF and mmW photonic systems for broadband wireless access and sensor applications.

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Section: Low-cost Substrate Integrated Circuits For Mmw Rof Applicmentioning

confidence: 99%

Radio-Frequency and Millimeter-Wave Photonic Techniques for Broadband Communications and Sensor Networks

Yao

Zhang

Kashyap³

et al. 2006

2006 Optics Valley of China International Symposium on Optoelectronics

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“…A wide range of applications in high-resolution imaging and broadband communication systems are finding their ways in the mm-wave band. Different technologies were developed by many researchers to accommodate the huge demand of systems in the mm-wave frequency-band such as integrated metallic waveguide structures [1]- [3], a dielectric insulated image guide [4], and Substrate Integrated Image Guide (SIIG) [5].…”

Section: Introductionmentioning

confidence: 99%

Novel D-band Si-based integrated platform for millimeter wave

Basha

Samir

Naeini

et al. 2014

2014 44th European Microwave Conference

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A low-cost and low-loss Silicon-on-Insulator (SOI) integrated platform is proposed for millimeter-wave (mm-wave) applications. The proposed platform supports mm-wave components in the D-band using dielectric image guide structure. The SOI mm-wave integrated platform uses high resistivity Silicon wafers for very low-loss in the D-Band. All passive components can be fabricated on the same platform with high potential of integration of active devices. There is no need for post-fabrication assembly steps for complex systems, which will provide high accuracy of placement of different components on the same platform. The platform is theoretically and experimentally investigated. The fabrication process is a simple one-mask fabrication process composed of deep reactive ion etching of the device layer of the SOI wafer. Design of dielectric image guide in the D-Band is performed. The simulation results show attenuation better than 0.25 dB/cm. Fabrication and experimental measurements are performed at 60 and 100 GHz.

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“…1 shows a CAD model of the designed and realised mm-wave front-end assembly. It comprises a planar dielectric rod antenna [5], a SIIG feed line [6], and an active MMIC that is interfaced with the SIIG via an integrated transition to the CPW [7]. Compared to the former transition design, the sensitivity to fabrication tolerances is greatly reduced by moving the CPW slot dipole (i.e.…”

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confidence: 99%

“…Nylon screws were used to attach the machined substrate to a brass plate serving as a ground plane for the SIIG and the antenna. An optional insulation film [6] was omitted in this case. The large via to ground that forms part of the CPW-SIIG transition [7] was realised in solid form.…”

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confidence: 99%