2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.22
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Sub-Micron Electrical Interconnection Enabled Ultra-High I/O Density Wafer Level SiP Integration

Chien-Ying Wu
1
,
Sheng-Yi Hsiao
2
,
Wei Lin
3
et al.
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