Study on the Thermomechanical Fatigue of Electronic Power Modules for Traction Applications in Electric and Hybrid Vehicles (IGBT)

Makhloufi, Abderahman; Aoues, Younès; Hami, Abdelkhalak El; Radi, Bouchaïb; Pougnet, Philippe; Delaux, David

doi:10.1016/b978-1-78548-260-1.50010-8

Cited by 5 publications

(4 citation statements)

References 4 publications

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“…[1,2]. In [3], the FEM is used for thermal fatigue life prediction, in [4], to analyse the reliability of plastic grid array, and in [5], to study the thermomechanical fatigue of electronic power modules. Even though some of these programs allow the user to perform probabilistic and reliability algorithms, it does not provide the opportunity to develop more efficient methodology for reliability analysis.…”

Section: Introductionmentioning

confidence: 99%

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS^© and R

Hamdani

Radi

Hami

2022

Int. J. Simul. Multidisci. Des. Optim.

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The complexity challenges of mechatronic systems justify the need of numerical simulation to efficiently assess their reliability. In the case of solder joints in electronic packages, finite element methods (FEM) are commonly used to evaluate their fatigue response under thermal loading. Nevertheless, Experience shows that the prediction quality is always affected by the variability of the design variables. This paper aims to benefit from the statistical power of the R software and the efficiency of the finite element software ANSYS©, to develop a probabilistic approach to predicting the solder joint reliability in Mechatronic Packaging taking into account the uncertainties in material properties. The coupling of the two software proved an effective evaluation of the reliability of the T-CSP using the proposed method.

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Section: Introductionmentioning

confidence: 99%

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS^© and R

Hamdani

Radi

Hami

2022

Int. J. Simul. Multidisci. Des. Optim.

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“…24 Currently, one of the challenges of HEV, related to the working conditions of the materials, is the thermal fatigue induced by the cyclic fluctuations in the temperature provoked by the charge and discharge of the batteries. 25,26 In order to face these requirements, the sandwich structures could be an alternative to take into consideration. Their main difference regarding to free-layer damping structures lies in the position of the viscoelastic layer within the hybrid structure.…”

Section: Introductionmentioning

confidence: 99%

Improvement of structural vibration damping performance of SMCs through SMC/TPE sandwich structures

Zulueta

Burgoa

Lekube

et al. 2022

J of Applied Polymer Sci

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Sheet molding compounds (SMCs) are interesting materials for the hybrid and electric vehicle (HEV) industry due to their high stiffness‐weight ratio, ease of processing, and competitive costs. Nevertheless, HEV industry demands advanced requirements such as enhanced vibration damping capabilities and thermal fatigue resistance. In this regard, the high stiffness of SMCs usually involves poor damping capacity, so improving the vibration damping behavior on SMCs proves to be a growing research line. The hybridization of SMCs with thermoplastic elastomers (TPEs), by means of free‐layer damping structures, has been confirmed as an effective way to enhance the damping properties of SMCs, but these structures lack the sufficient temperature resistance for certain applications. In this work, the hybridization of epoxy‐based carbon fiber SMC with TPE by sandwich structures has been studied as an innovative strategy to address the enhancement of the vibration damping capacities of SMCs and assure their usage on temperature applications. The mechanical properties, vibration damping performance, and influence of temperature of the sandwich structures has been analyzed by quasi‐static 3‐point bending tests and dynamic mechanical analysis. Experimental tests show the capability of hybrid sandwich structures to boost the vibration damping efficiency of SMCs while keeping their suitability for structural applications.

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“…It's a stochastic research method based on the population in continuous and discrete spaces [17], it is used to solve optimization problems by minimizing an objective function, the objective function to be minimized depends on the failure mode. This method has shown its efficiency through results obtained in several works which aim at the reliability of systems [18]. The CMA-ES method is based on the finite element model to solve the optimization problem but, this method is no longer practicable when the finite element model takes tens of minutes.…”

Section: Introductionmentioning

confidence: 99%

Optimization based on electro-thermo-mechanical modeling of the high electron mobility transistor (HEMT)

Amar

Radi

Hami

2022

Int. J. Simul. Multidisci. Des. Optim.

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The electro-thermomechanical modeling study of the High Electron Mobility Transistor (HEMT) has been presented, all the necessary equations are detailed and coupled. This proposed modeling by the finite element method using the Comsol multiphysics software, allowed to study the multiphysics behaviour of the transistor and to observe the different degradations in the structure of the component. Then, an optimization study is necessary to avoid failures in the transistor. In this work, we have used the Covariance Matrix Adaptation-Evolution Strategy (CMA-ES) method to solve the optimization problem, but it requires a very important computing time. Therefore, we proposed the kriging assisted CMA-ES method (KA-CMA-ES), it is an integration of the kriging metamodel in the CMA-ES method, it allows us to solve the problem of optimization and overcome the constraint of calculation time. All these methods are well detailed in this paper. The coupling of the finite element model developed on Comsol Multiphysics and the KA-CMA-ES method on Matlab software, allowed to optimize the multiphysics behaviour of the transistors. We made a comparison between the results of the numerical simulations of the initial state and the optimal state of the component. It was found that the proposed KA-CMA-ES method is efficient in solving optimization problems.

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Study on the Thermomechanical Fatigue of Electronic Power Modules for Traction Applications in Electric and Hybrid Vehicles (IGBT)

Cited by 5 publications

References 4 publications

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS^© and R

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS^© and R

Improvement of structural vibration damping performance of SMCs through SMC/TPE sandwich structures

Optimization based on electro-thermo-mechanical modeling of the high electron mobility transistor (HEMT)

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Study on the Thermomechanical Fatigue of Electronic Power Modules for Traction Applications in Electric and Hybrid Vehicles (IGBT)

Cited by 5 publications

References 4 publications

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R

Improvement of structural vibration damping performance of SMCs through SMC/TPE sandwich structures

Optimization based on electro-thermo-mechanical modeling of the high electron mobility transistor (HEMT)

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Product

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Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS^© and R

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS^© and R