Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS^©and R

Abstract

The complexity challenges of mechatronic systems justify the need of numerical simulation to efficiently assess their reliability. In the case of solder joints in electronic packages, finite element methods (FEM) are commonly used to evaluate their fatigue response under thermal loading. Nevertheless, Experience shows that the prediction quality is always affected by the variability of the design variables. This paper aims to benefit from the statistical power of the R software and the efficiency of the finite element software ANSYS©, to develop a probabilistic approach to predicting the solder joint reliability in Mechatronic Packaging taking into account the uncertainties in material properties. The coupling of the two software proved an effective evaluation of the reliability of the T-CSP using the proposed method.

Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents

“…Testing approaches to estimating reliability require considerable time for sample preparation, which increases costs and lengthens the time taken to obtain responses. Numerical simulations using finite elements are increasingly used to predict numerically the reliability of electronic microcomponents (Belhenini et al, 2023;Hamdani et al, 2022;Gharaibeh et al, 2019). In numerical approaches, equivalent stresses and plastic strains are commonly used as reliability criteria.…”

“…Numerical simulations using finite elements are increasingly used to predict numerically the reliability of electronic microcomponents (Belhenini et al. , 2023; Hamdani et al. , 2022; Gharaibeh et al.…”