Study on the interdiffusion in base-metal-electrode MLCCs

Gui, Zhi Lun; Wang, Y.L.; Li, L.T.

doi:10.1016/j.ceramint.2003.12.038

Cited by 18 publications

(18 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…One previous study suggested that the solubility of Ni in BaTiO 3 is a function of oxygen partial pressure in the sintering atmosphere [3]. Though the solubility of Ni in BaTiO 3 is relatively low, the diffusion distance is approaching the same order of the dielectric thickness [7], which is typically around 5 μm in present-day electronics.…”

Section: Introductionmentioning

confidence: 98%

See 1 more Smart Citation

Solubility of Ni in BaTiO3 during co-firing

Huang

Tuan

2007

J Electroceram

View full text Add to dashboard Cite

Nickel is now frequently used as internal electrodes for multilayer ceramic capacitors (MLCC). In order to evaluate the effect of the presence of metallic Ni on the properties of BaTiO 3 -based dielectrics, nano-sized Ni particles are mixed thoroughly with BaTiO 3 powder and subsequently sintered at 1,330°C in nitrogen. The oxygen partial pressure in the nitrogen is slightly higher than the equilibrium oxygen partial pressure for the Ni→NiO reaction. Under such a condition, an upper limit of 5,400± 540 ppm for the solubility of Ni in BaTiO 3 is detected. The Ni solute acts as an acceptor to BaTiO 3 , and its presence increases the reduction resistance of BaTiO 3 significantly.

show abstract

Section: Introductionmentioning

confidence: 98%

“…The available data on the solubility and diffusion of Ni in BaTiO 3 -based dielectrics are summarized in Table 1 [2][3][4][5][6][7]. From the Table, the limited data suggest many inconsistencies.…”

Section: Introductionmentioning

confidence: 99%

Solubility of Ni in BaTiO3 during co-firing

Huang

Tuan

2007

J Electroceram

View full text Add to dashboard Cite

show abstract

“…Many researchers have paid great attention in the electrode of MLCCs with low producing cost by adapting base metals or base-metal alloys as the electrode [4][5][6]. Ni-electrode MLCCs were widely studied aiming on the performance enhancing and the reliability improving.…”

Section: /[280]mentioning

confidence: 99%

STABILITY OF METAL ELECTRODES FOR MLCC WITH BaTiO₃ THIN LAYERS BY DEPOSITION METHOD

Park

2005

Integrated Ferroelectrics

View full text Add to dashboard Cite

The stability of various base metal electrodes was examined for the preparation of MLCC by deposition method. The electrical resistivity of Al and NiCr was lower than Ni and Cu and the Cu and Ni films showed a poor adhesion with Si substrate. The resistivity of Al film was 4 × 10 −6 -cm. Ni-Cr film deposited at room temperature have a columnar structure and higher roughness than Al films. As-deposited Al and NiCr show the rms roughness of 35 and 145 • A, respectively and Al films showed the very stable structure after annealing. NiCr films show the formation of NiCr 2 O 4 phase at surface after annealing. The capacitance change with electrodes was neglectable but dissipation factor of Al/BaTiO 3 /Al was more stable than NiCr/BaTiO 3 /NiCr structure. The NiCr/BaTiO 3 /NiCr structure showed higher leakage current than that of Al/BaTiO 3 /Al.

show abstract

“…Although the Fig. 1 XRD traces of a asreceived, with the slow scanning of {002} peak shown inset, and b polished MLCC chips interface of Ni-electrode and BaTiO 3 dielectric layer of a Y5V composition was studied for interdiffusion [16], very rarely were the microstructure of commercial MLCC chips investigated under TEM for improving the manufacturing process that is known to require high precision, to be complicated, and sensitive to many unidentified parameters [18]. Residual pores in the Ni electrode layers have often been found in almost all MLCC chips, but its origin was not fully understood.…”

Section: Introductionmentioning

confidence: 99%

Microstructure analysis of the Y5V multilayer ceramic capacitors based on BaTiO3

Lee

et al. 2007

J Electroceram

View full text Add to dashboard Cite

The Y5V-1206 base-metal electrode (BME) multilayer ceramic capacitor (MLCC) chips have been characterised for crystalline phases using X-ray diffractometry (XRD), and microstructure using optical microscopy (OM), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The microstructure features found in the Ni electrode and the BaTiO 3 dielectric layer are discussed in terms of the tensile backstresses induced upon firing due to constrained sintering heterogeneously. The chemical compositions containing BaO-excess and additives CaO and ZrO 2 , determined for BaTiO 3 grains by energydispersive spectroscopy (EDS) equipped in the TEM are also reported. However, no rare-earth oxides were found in the grains. The representative microstructure of BaTiO 3 grains containing dislocations is the "solid-solution" type distinctive from the "core-shell" of the X7R compositions. The fact that no ferroelectric domains were detected suggests that the BaTiO 3 grains are pseudo-cubic with the c/a ratio ≈ 1.0.

show abstract

Study on the interdiffusion in base-metal-electrode MLCCs

Cited by 18 publications

References 8 publications

Solubility of Ni in BaTiO3 during co-firing

Solubility of Ni in BaTiO3 during co-firing

STABILITY OF METAL ELECTRODES FOR MLCC WITH BaTiO₃ THIN LAYERS BY DEPOSITION METHOD

Microstructure analysis of the Y5V multilayer ceramic capacitors based on BaTiO3

Contact Info

Product

Resources

About

Study on the interdiffusion in base-metal-electrode MLCCs

Cited by 18 publications

References 8 publications

Solubility of Ni in BaTiO3 during co-firing

Solubility of Ni in BaTiO3 during co-firing

STABILITY OF METAL ELECTRODES FOR MLCC WITH BaTiO3 THIN LAYERS BY DEPOSITION METHOD

Microstructure analysis of the Y5V multilayer ceramic capacitors based on BaTiO3

Contact Info

Product

Resources

About

STABILITY OF METAL ELECTRODES FOR MLCC WITH BaTiO₃ THIN LAYERS BY DEPOSITION METHOD