STABILITY OF METAL ELECTRODES FOR MLCC WITH BaTiO₃ THIN LAYERS BY DEPOSITION METHOD

Abstract

The stability of various base metal electrodes was examined for the preparation of MLCC by deposition method. The electrical resistivity of Al and NiCr was lower than Ni and Cu and the Cu and Ni films showed a poor adhesion with Si substrate. The resistivity of Al film was 4 × 10 −6 -cm. Ni-Cr film deposited at room temperature have a columnar structure and higher roughness than Al films. As-deposited Al and NiCr show the rms roughness of 35 and 145 • A, respectively and Al films showed the very stable structure after annealing. NiCr films show the formation of NiCr 2 O 4 phase at surface after annealing. The capacitance change with electrodes was neglectable but dissipation factor of Al/BaTiO 3 /Al was more stable than NiCr/BaTiO 3 /NiCr structure. The NiCr/BaTiO 3 /NiCr structure showed higher leakage current than that of Al/BaTiO 3 /Al.