2022
DOI: 10.4028/p-jp0ijg
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Study on Soldering Alloy Structure Influence on Whiskers Germination and Grow Process in Joints Executed Using Tin Base Soldering Alloys

Abstract: Electronic components soldered with tin base alloys are subject to whiskers formations after an operation period, which produced failures by short circuits. The main factors which determine formation of whiskers are soldering alloy characteristics, substrate alloys which is placed on the surface of the PCB boards and not the least the working environment. Soldering alloy has a major influence on germination and growing whiskers process, by its nature and grain form, dimensions and orientation. Given the prelim… Show more

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