Study on Reaction Diffusion in the Nickel-Zinc System

Shimozaki, Toshitada; Onishi, Masami

doi:10.2320/jinstmet1952.42.4_402

Cited by 10 publications

(7 citation statements)

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“…And, it was reported that γ-phases in the initial step of reaction exist in three diffusion layers of γ (78-79 at.% Zn), γ (80.5-82 at.% Zn) and γ (84-85 at.% Zn) [11]. Differences in lattice parameter and composition among the γ , γ and γ phases is very small [12], and it is difficult to distinguish the phases because they are beyond the resolution limits of the diffraction patterns and EDS by TEM. More precise investigation with the X-ray diffraction technique is under progress.…”

Section: Resultsmentioning

confidence: 97%

Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad

Kim¹,

Yang²,

Yu³

et al. 2004

Journal of Alloys and Compounds

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Section: Resultsmentioning

confidence: 97%

Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad

Kim¹,

Yang²,

Yu³

et al. 2004

Journal of Alloys and Compounds

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“…The value, R c = 500, seems to be extremely large, however, there are some other systems in which one component moves very fast than the other component. For example, in Fe-Zn [18] and Ni-Zn [19] binary alloy systems the Kirkendall markers locate just at the f/Zn phase boundary for Fe-Zn and c/Zn phase boundary for N-Zn. Therefore, it has been considered to be almost one side diffusion of Zn, i.e., R = D Zn /D Fe or Ni % ¥, in these f and c diffusion layers.…”

Section: Movement Of M-msmentioning

confidence: 98%

Movement of Multiple Markers in Cu/Zn Multiple Phase Diffusion Couples and Its Numerical Analysis

Shimozaki

Lee

2016

J. Phase Equilib. Diffus.

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Movement of multiple markers (M-Ms) embedded in the Cu end member of a Cu/Zn multiple phases diffusion couple (M-couple) has been experimentally investigated at 623 K and the alignment of the M-Ms after diffusion anneal was reproduced by the numerical analysis that the authors have previously reported. Two intermediate phases, c and e, were found in the Cu/Zn M-couple. The M-Ms bent toward Zn side at Cu/c phase interface and show almost a linear line in the c phase. They again bent at c/e interface toward Zn side. The Kirkendall marker position, X k , locates in the e phase layer. From this result, ratio, R = D Zn /D Cu , of the intrinsic diffusion coefficients with respect to the mole fixed frame of reference was determined to be about 46 at X k . On the assumption of a constant value of R = 46 in the e phase and appropriate constant values of R = 10-1000 in the c phase, alignments of M-Ms after diffusion anneal were numerically reproduced. By fitting the alignment of M-Ms obtained numerically on the experimental result, the value R in c phase is estimated to be very large value of 500.

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“…%Zn), which have the same structure as Ni 5 Zn 21 . 6 Differences in lattice parameter and composition among the γ′′, γ′′′, and γ′ phases are very slight, and it is difficult to distinguish the phases because they are beyond the resolution limits of the diffraction patterns and EDS by TEM. Kim et al 13 AuSn 4 were formed in the interface and inside the Sn-37Pb solder, respectively.…”

Section: Resultsmentioning

confidence: 99%

“…However, other Sn-based solders generate the Au-Sn and Ni-Sn IMCs. [5][6][7][8][9][10][11][12][13][14] In this study, Sn-37Pb and low-temperature Sn8Zn-3Bi lead-free solder balls were soldered to the chip-scale package (CSP) by a reflow process. To evaluate the pull strengths of the solder joints, each CSP sample was aged at 100°C and 150°C, respectively.…”

Section: Introductionmentioning

confidence: 99%

Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solder

Kim

Jeon

2005

Journal of Elec Materi

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The microstructure of Sn-37Pb and Sn-8Zn-3Bi solders and the full strength of these solders with an Au/Ni/Cu pad under isothermal aging conditions were investigated. The full strengths tended to decrease as the aging temperature and time increased, regardless of the properties of the solders. The Sn-8Zn-3Bi had higher full strength than Sn-37Pb. In the Sn-37Pb solder, Ni 3 Sn 4 compounds and irregular-shaped Pb-rich phase were embedded in a β-Sn matrix. The Ni 3 Sn 4 compounds were observed at the interface between the solder and pad. The microstructure of the as-reflowed Sn-8Zn-3Bi solder mainly consists of the β-Sn matrix scattered with Zn-rich phase. Zinc first reacted with Au and then was transformed to the AuZn compound. With aging, Ni 5 Zn 21 compounds were formed at the Ni layer. Finally, a Ni 5 Zn 21 phase, divided into three layers, was formed with column-shaped grains, and the thicknesses of the layers were changed.

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Study on Reaction Diffusion in the Nickel-Zinc System

Cited by 10 publications

References 0 publications

Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad

Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad

Movement of Multiple Markers in Cu/Zn Multiple Phase Diffusion Couples and Its Numerical Analysis

Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solder

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