Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad

Kim, Kyung-Seob; Yang, Jun‐Mo; Yu, Chong-Hee; Jung, In-Ok; Kim, Heon-Hee

doi:10.1016/j.jallcom.2004.03.138

Cited by 77 publications

(55 citation statements)

References 11 publications

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“…Transmission geometry and the high penetration depth of synchrotron radiation allow diffraction data to be obtained from representative large sample volumes. The diffraction data were collected using an area detector, located at a distance of 1070 mm from the sample, with a beam size of 0.5 9 0.5 mm 2 . To ensure that the optimal volume of Sn-Zn0.2Na/Ni is in the beam, the sample was measured at three different sites across the interface.…”

Section: Methodsmentioning

confidence: 99%

“…1,[3][4][5][6] The microstructures of soldered joints with Sn-9Zn binary alloys were investigated, as were their interfaces with Cu. 2,[6][7][8][9] However, coupon testing demonstrated a thickening of the Cu 5 Zn 8 phase layer at the interface, as well as the formation of voids, with increasing aging time. 10 Therefore, the Ni layer at the interface caused the formation of intermetallic compounds (IMCs) from the Cu-Zn system to be blocked, 2,[11][12][13] and allowed the formation of Sn-Ni-Zn phases.…”

Section: Introductionmentioning

confidence: 99%

“…2,[6][7][8][9] However, coupon testing demonstrated a thickening of the Cu 5 Zn 8 phase layer at the interface, as well as the formation of voids, with increasing aging time. 10 Therefore, the Ni layer at the interface caused the formation of intermetallic compounds (IMCs) from the Cu-Zn system to be blocked, 2,[11][12][13] and allowed the formation of Sn-Ni-Zn phases. 14 Interfacial reactions between Sn-Zn solder and Ni will occur during reflow and subsequent solid-state annealing, and Ni 5 Zn 21 is the primary phase formed at the Sn9wt.% Zn/Ni interface.…”

Section: Introductionmentioning

confidence: 99%

“…1 However, Sn-Zn eutectic solder is difficult to use, especially due to its highly active characteristics. 2 Therefore, alloying additives are combined with Sn-Zn alloys. 1,[3][4][5][6] The microstructures of soldered joints with Sn-9Zn binary alloys were investigated, as were their interfaces with Cu.…”

Section: Introductionmentioning

confidence: 99%

“…13 The introduction of a new coating layer (Au 2 ) did not provide protection before the formation of the Ni-Zn phases. 2 Taking into account that Zn has a strong chemical affinity with Cu, the amount of soluble Zn content in the solder should be reduced. [18][19][20] Similar behavior for Sn-Zn with Ga and Na 22 on Cu substrate was observed.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate

Gancarz

Bobrowski

Pawlak

et al. 2017

Journal of Elec Materi

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Wetting of Al and Ni substrate by Sn-Zn eutectic-based alloys with 0.5 (wt.%) of Ga and 0.2 (wt.%) of Na was studied using the sessile drop method in the presence of ALU33 Ò flux. Spreading tests were performed for 60 s, 180 s, and 480 s of contact, at temperatures of 503 K, 523 K and 553 K (230°C, 250°C, and 280°C). After cleaning the flux residue from solidified samples, the spreading areas of Sn-Zn0.5Ga and Sn-Zn0.2Na on Al and Ni substrate were determined. Selected, solidified solder-pad couples were cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy, x-ray diffraction study and synchrotron measurements of the interfacial microstructure and identification of the phases. The growth of the intermetallic Ni 5 Zn 21 phase layer was studied at the solder/Ni substrate interface, and the kinetics of the formation and growth of the intermetallic layer were determined. The formation of interlayers was not observed on the Al pads. On the contrary, dissolution of the Al substrate and migration of Alrich particles into the bulk of the solder were observed.

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Section: Methodsmentioning

confidence: 99%