Study on Adhesion Improvement of Polyimide Film

Katoh, Kohji; Motobe, Takeharu; Oh‐e, Masahito; Soejima, Kazuya; Kaneya, Yuichi; Tanaka, Toshiaki; Itabashi, Toshiaki

doi:10.2494/photopolymer.22.393

Cited by 3 publications

(1 citation statement)

References 4 publications

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“…1) However, this technique is not suitable from an environmental viewpoint because of the consequential need for liquid waste treatment. As one of the surface treatment processes, plasma surface treatments using reduced pressures, [2][3][4][5][6][7][8] atmospheric pressure, [8][9][10][11] or ion beams [12][13][14][15] have been reported, but the process throughput is not sufficient for high-speed roll-to-roll sputter deposition, and an alternative high-density plasma is desired. As a candidate to solve such an issue, a surface-wave plasma (SWP) source, i.e., a microwave plasma source with no magnetic field, is attractive.…”

Section: Introductionmentioning

confidence: 99%

Low-pressure sustainment of surface-wave microwave plasma with modified microwave coupler

Sasai

Suzuki

Toyoda

2015

Jpn. J. Appl. Phys.

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Sustainment of long-scale surface-wave plasma (SWP) at pressures below 1 Pa is investigated for the application of the SWP as an assisting plasma source for roll-to-roll sputter deposition. A modified microwave coupler (MMC) for easier surface-wave propagation is proposed, on the basis of the concept of the power direction alignment of the slot antenna and surface-wave propagation. The superiority of the MMC-SWP over conventional SWPs is shown at a sustainment pressure as low as 0.6 Pa and an electron density as high as 3 × 1017 m−3. A polymer film is treated with the MMC-SWP at a low pressure of 0.6 Pa, and surface modification at a low pressure is proved using Ar plasma. These results show the availability of the MMC-SWP as the surface treatment plasma source that is compatible with sputter deposition in the same processing chamber.

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