Rapid plasma treatment of polyimide for improved adhesive and durable copper film deposition

Usami, K.; Ishijima, Tatsuo; Toyoda, Hirotaka

doi:10.1016/j.tsf.2012.03.080

Cited by 29 publications

(23 citation statements)

References 26 publications

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“…In addition, an APPJ is a very simple, small‐scale, damage‐free, and cost‐effective process, capable of patterning films without a mask. In previous studies on Cu films deposition using APPJ in air, it was found that purity of the Cu film was significantly improved by adding a fractional amount of H 2 gas into the Ar gas; this caused reduction reactions of the oxidized Cu films by the hydrogen atoms . Under an air atmosphere, however, oxidization of the Cu film is inevitable because of the presence of oxygen in air …”

Section: Introductionmentioning

confidence: 99%

Highly Conductive Cu Thin Film Deposition on Polyimide by RF‐Driven Atmospheric Pressure Plasma Jets under Nitrogen Atmosphere

Zhao

Zheng

Watanabe

et al. 2015

Plasma Processes & Polymers

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The use of Ar/H2 atmospheric pressure plasma jets driven by a 13.56 MHz RF wave source with a Cu inner conductor was investigated for the deposition of highly conductive Cu thin films on polyimide substrates. It was found that the intensities of the Cu atom emission line were significantly increased by the addition of H2 gas to the Ar plasmas. Secondary emission microscopy analysis indicated that the Cu films exhibited agglomerated structures with grains of several microns, which were larger than those produced using Ar plasma jets. It was found that the conductivity of Cu thin films prepared in nitrogen was 106 times higher than that of films produced using Ar/H2 plasma jets with 10 sccm H2, and 4 times higher than that for films produced using identical Ar/H2 plasma jets in air.

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Section: Introductionmentioning

confidence: 99%

Highly Conductive Cu Thin Film Deposition on Polyimide by RF‐Driven Atmospheric Pressure Plasma Jets under Nitrogen Atmosphere

Zhao

Zheng

Watanabe

et al. 2015

Plasma Processes & Polymers

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show abstract

“…[ 4 ] Intentional roughening and introducing active functional groups on polymer substrates by oxidizing reaction are common ways to improve the adhesion strength between metal and substrate. [ 5,6 ] Those treatments can increase the interfacial area between the metal layer and substrate, leading to the improved adhesion strength, but also lead to high surface roughness that will cause the signal transfer loss. [ 7 ] As an alternate, the introduction of polymeric interface layer showing strong affinity with metal ions has been investigated.…”

Section: Figurementioning

confidence: 99%

Green Fabrication of Highly Conductive Paper Electrodes via Interface Engineering with Aminocellulose

Yang

Huang

et al. 2020

Macromol. Rapid Commun.

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Herein, a novel, facile, and versatile approach to fabricate highly flexible and conductive paper is proposed by electroless deposition (ELD) with the assistance of aminocellulose as the interface layer. The obtained Cu nanoparticles (NPs)‐coated cellulose paper is highly conductive with a significant low resistance of 0.38 Ω sq−1 after only 10 min of ELD treatment. This conductive cellulose paper shows excellent stability when it suffers from bending, folding, and tape adhesion cycles. With the same method, the Cu NPs can also be successfully deposited on the polypropylene (PP)‐filled hybrid paper. The conductive paper exhibits very smooth and hydrophobic surface with high reflection, which can be used for special electronic devices. In a word, the fabrication of aminocellulose interface permits a controlled ELD of metal nanoparticles on paper substrate, and this mild and low‐cost method opens up new opportunities for large‐scale production of flexible and wearable electronics.

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“…At present, the most commonly modified PI polymers are films and wet‐spun fibers. Although dry chemical processes, such as plasma and ion‐beam processes, can improve the moisture absorption, friction, and adhesive properties of films, these methods bring about some severe drawbacks, including poor mechanical properties and a high cost . Therefore, the dry process is not suitable for PI fiber modification.…”

Section: Introductionmentioning

confidence: 99%

Modification of dry‐spun Suplon polyimide fibers by mixed‐acid oxidation and their effects on the properties of polypropylene‐resin‐based composites

Chen

Long

Zhang

et al. 2017

J of Applied Polymer Sci

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In this study, the effects of mixed-acid oxidation on the contents of surface elements, morphology, fiber fineness, mechanical properties, mass change rate, chemical structure, and microaggregate structure of dry-spun Suplon polyimide (PI) fibers were systematically investigated with wet chemical treatment with HNO 3 /H 2 SO 4 . Experiments investigating both the improvement in the O/C ratio of the fiber surface elements and the changes in other performance features were conducted through the functional modification of the fibers. Meanwhile, the causes of specific changes in the mechanical properties of the oxidized PI-fiber-reinforced polypropylene-resin-based composites were studied and are discussed. The results of this study demonstrate that the treatment of the fibers with HNO 3 /H 2 SO 4 mixed-acid oxidation resulted in significant changes in the properties of the fibers; these changes included an uneven surface, increased specific surface area and surface roughness, a locally etched surface, increased surface energy and O/C ratio, an enhanced wettability, an increased fiber fineness, reduced mechanical properties, and a mass gain in the fibers. Although the chemical structures of the fibers treated by oxidized HNO 3 /H 2 SO 4 were not significantly changed compared to those of the untreated fibers, the microscopic aggregation of the treated fibers changed to some degree, and the ratio of the amorphous regions significantly increased. Taken together, the functional modification of the PI fiber surface was achieved efficiently through the use of a suitable HNO 3 /H 2 SO 4 oxidation process and with other performance features of the fibers taken into account. This was favorable for the enhancement of the interfacial properties of the polypropylene fibers and the matrix resins, and thus, the modification improved the mechanical properties of the composites.

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Rapid plasma treatment of polyimide for improved adhesive and durable copper film deposition

Cited by 29 publications

References 26 publications

Highly Conductive Cu Thin Film Deposition on Polyimide by RF‐Driven Atmospheric Pressure Plasma Jets under Nitrogen Atmosphere

Highly Conductive Cu Thin Film Deposition on Polyimide by RF‐Driven Atmospheric Pressure Plasma Jets under Nitrogen Atmosphere

Green Fabrication of Highly Conductive Paper Electrodes via Interface Engineering with Aminocellulose

Modification of dry‐spun Suplon polyimide fibers by mixed‐acid oxidation and their effects on the properties of polypropylene‐resin‐based composites

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