Study of thin film metallization adhesion in ceramic multichip module

Dy, Lim Ju; Rong, Eric Phua Jian; Made, Riko I; Sharif, Ahmed; Zhang, Lim Jun; Long, Lau Fu; Gan, Chee Lip; Zhong, Cheng; MinWoo, Daniel Rhee; Cheong, Wai Chye

doi:10.1109/eptc.2012.6507053

Cited by 3 publications

(1 citation statement)

References 18 publications

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“…When MnZn ferrite is used in electronic components, in order to strengthen its adhesion to metal electrodes, surface modification is required [8,9]. In addition, when MnZn ferrite is used in microwave devices, the surface of the ferrite also needs to be modified in order to make the electromagnetic wave propagate inside the device and avoid the loss of the electromagnetic wave [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Titanium Oxide Coatings Deposited on MnZn Ferrite by a Molten Salt Reaction

et al. 2022

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Using molten salt reactions, Ti oxide coatings were successfully deposited on MnZn ferrite in a NaCl–KCl–K2TiF6 melt. The film formed on the surface of MnZn ferrite had a thickness of up to 20 μm and was composed of Ti oxides. The electric conductivity of the coatings was contributed to by the component Ti2O3 and depended on the concentration of Ti2O3 in the film. When the Ti2O3 content in the film increased, the surface resistance dropped to the order of 10−1 Ω/□. The conductive film had the potential to be welded to the metal electrode, thus confirming that the molten salt reaction method could be used as a pre-treatment to realize the metallization of MnZn ferrite.

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Section: Introductionmentioning

confidence: 99%

Titanium Oxide Coatings Deposited on MnZn Ferrite by a Molten Salt Reaction

et al. 2022

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Temperature cycle test study on thick metal passivation cracks

Ahmataku¹,

Sethu²

2017

2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM)

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Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications

Phua

Liu

Made

et al. 2013

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)

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A modified thermoset polymer resin (PR) is evaluated as a form of alternative packaging material to traditional epoxy. It is understood that the thermoset cross-links to a higher degree at high temperature. Hence, its mechanical properties can be improved by changing treatment duration and temperature, rendering the material mechanically stronger for application temperatures beyond 300°C. Material strength was evaluated through a modified compressive testing setup which shows neat PR is comparable to epoxy. Concurrently, adhesion to silicon die and ceramic substrate were evaluated by means of bond shear using the DAGE-4000 shear tester both at room temperature and elevated temperature. Bond shear strength of PR is observed to be higher at room temperature as compared to elevated temperatures when bonded to Silicon (Si) and Alumina (Al2O3), a phenomenon which can be attributed to mismatches in coefficient of thermal expansions (CTE). For high pressure only applications, PR is a good alternative. Pre- and post-pressure loading analysis was carried out by forming an encapsulation analogous to that of a glob top on DIP packages. Observation shows no crack formation, indicating that the material is suitable for high pressure loading up to 207 MPa. For high pressure and high temperature applications (HPHT), pure PR is good up to 250°C at 25 kPsi (172 MPa).

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Study of thin film metallization adhesion in ceramic multichip module

Cited by 3 publications

References 18 publications

Titanium Oxide Coatings Deposited on MnZn Ferrite by a Molten Salt Reaction

Titanium Oxide Coatings Deposited on MnZn Ferrite by a Molten Salt Reaction

Temperature cycle test study on thick metal passivation cracks

Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications

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