Study of thermal effects in GaAs micromachined power sensor microsystems by an optical interferometer technique

Pogány, D.; Seliger, N.; Lalinský, T.; Kuzmı́k, J.; Habaš, P.; Hrkut, P.; Gornik, E.

doi:10.1016/s0026-2692(97)00057-8

Cited by 7 publications

(4 citation statements)

References 8 publications

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“…According to Senturia and Howe [45], the ideal suites of CAD tools required for MEMS development are [49]:…”

Section: Computer-aided Mems Designmentioning

confidence: 99%

“…The power sensor exhibited a sensitivity over 10 V/W and yielded thermal resistance that exceeded 5200 K/W. The thermal time constant of 5 ms was measured using both electrical and optical methods [49,50].…”

Section: Micromachined Thermal Convertersmentioning

confidence: 99%

“…The Merge Layers and Extrude option have been used to merge and extrude all layers in order to produce a continuous brick mesh of non-orthogonal model shapes. Considering accurate solutions of movable parts, parabolic 27-node elements have been chosen [49]. To reduce the number of nodes, thereby the computing time, we created gradation towards small features in the models and larger elements in the open spaces.…”

Section: D Modelmentioning

confidence: 99%

“…[58,59]), the area temperature distribution on the surface considered can be mapped. Detecting of temperature development on GaAs based beam element thermally isolated by surface polyimid coating is presented in [49,50] where the temperature variations with a sensitivity of about 1.0 K −1 were successfully identified. On the other hand, observing thin film fringe pattern, experimentalist is frequently confronted with the problem of disturbancy of the surface profile interference pattern by fringes coming from thin layer interferency.…”

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confidence: 99%

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Web-Enabled Knowledge-Intensive Support Framework for Collaborative Design of MEMS

Zha

Mems/Nems

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Micro-Electro-Mechanical Systems (MEMS) design and manufacturing are inherently multi-physical and multi-disciplinary; no single person is able to perform a full development process for a MEM device or system. This chapter presents a web-enabled design platform for collaborative design of MEMS. The proposed web-based distributed object modeling and evaluation framework with client-knowledge server architecture, KS-DMME, allows multi-users/designers in different locations to participate in the same design process. Under this framework, concurrent integrated MEMS design and simulation models can be built using both local and distributed resources, and the design collaboration can be realized by exchanging services between modules based upon CORBA standard communication protocol. To facilitate the rapid construction of the concurrent integrated design models for MEMS, a prototype web-enabled design system, Web-MEMS Designer, is implemented through concurrent integration of multiple distributed and cooperative knowledge sources and software. By use of the developed prototype system, MEMS design and simulation can be carried out simultaneously and intelligently in an integrated but open design environment on the web. A case study of a microgripper design for micro robotic assembly systems is provided to illustrate how designers in different teams and organizations may participate and collaborate in MEMS design.

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“…According to Senturia and Howe [45], the ideal suites of CAD tools required for MEMS development are [49]:…”

Section: Computer-aided Mems Designmentioning

confidence: 99%

Section: Micromachined Thermal Convertersmentioning

confidence: 99%

Section: D Modelmentioning

confidence: 99%

mentioning

confidence: 99%

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