1977
DOI: 10.1149/1.2133156
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Study of Encapsulants for Annealing GaAs

Abstract: Low temperature photoluminescence and Auger electron spectroscopy have been used to study chemical-vapor deposited SiO2 and SigN4 layers as encapsulants for high temperature annealing of GaAs. Silicon dioxide or silicon oxynitride layers allow out-diffusion of Ga, while suitably prepared rf plasma deposited SisN4 layers can be used to anneal GaAs with negligible Ga outdiffusion.

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Cited by 90 publications
(13 citation statements)
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“…12 It is also known that annealing without dielectric caps results in the loss of As from the sample surface, hence, generating a large number of group V vacancies. 13 These observations suggest that, although As outdiffusion ͑and hence, the generation of group V point defects͒ does not have a great impact on intermixing, it may cause broadening of the PL linewidth from the dots. Conversely, when Ga outdiffusion, and hence, group III point defect generation, is used to control the intermixing of the QDs, narrowing in the emission linewidth from the dots is achieved.…”
Section: Methodsmentioning
confidence: 97%
“…12 It is also known that annealing without dielectric caps results in the loss of As from the sample surface, hence, generating a large number of group V vacancies. 13 These observations suggest that, although As outdiffusion ͑and hence, the generation of group V point defects͒ does not have a great impact on intermixing, it may cause broadening of the PL linewidth from the dots. Conversely, when Ga outdiffusion, and hence, group III point defect generation, is used to control the intermixing of the QDs, narrowing in the emission linewidth from the dots is achieved.…”
Section: Methodsmentioning
confidence: 97%
“…IFVD utilizes Ga out-diffusion into dielectric caps at elevated temperatures to introduce group-III point defects [27]. Since its discovery [28], it has been widely used to fabricate OEIC's and PIC's [12], [14].…”
Section: Kinetics Of Ifvdmentioning
confidence: 99%
“…The dangling bonds in the amorphous SiO 2 act as sources of point defects. 17) The point defect in the SiO 2 film diffuses into the semiconductor during heating assisted by the strain caused by the difference in thermal expansion coefficient between the semiconductor and the SiO 2 film. 18) The thickness of the SiO 2 film was varied from 30 to 500 nm to investigate the effect of the amount of introduced point defects.…”
mentioning
confidence: 99%