2005
DOI: 10.1016/j.matchemphys.2004.08.031
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Studies on three-dimensional moulding, bonding and assembling of low-temperature-cofired ceramics for MEMS and MST applications

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Cited by 20 publications
(16 citation statements)
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“…chemical inactivity, hermeticity, matching of thermal expansion coefficient with silicon, high temperature stability, and 3D structuration) [1,2]. Especially interesting are microfluidic applications.…”
Section: Introductionmentioning
confidence: 99%
“…chemical inactivity, hermeticity, matching of thermal expansion coefficient with silicon, high temperature stability, and 3D structuration) [1,2]. Especially interesting are microfluidic applications.…”
Section: Introductionmentioning
confidence: 99%
“…Most micro-sensors such as pressure sensors, flow sensors, etc., are created using silicon material [1][2][3][4][5][6]. In recent years, however, low-temperature co-fired ceramic (LTCC) technology has been applied in various fields, including electrochemical devices, (bio)medical devices, pressure sensors, flow sensors, etc., [7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Next, the LTCC module is cofired at a two-step thermal profile with a peak temperature of 850-900 o C. Fired LTCC material usually has very good temperature stability (up to 650 o C) [2,3], and some compositions also exhibit a high degree of chemical resistance, making them suitable for fabrication of chemical microreactors, even for aggressive substances [4]. Finally, its CTE (coefficient of thermal expansion) is reasonably well matched to that of silicon [5]. Thanks to all these advantages, LTCC technology is well established in both low-volume, high-performance and highvolume, low-cost applications.…”
Section: Introductionmentioning
confidence: 99%