2002
DOI: 10.1016/s0040-6090(02)00971-9
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Structure and characteristics of ZnO:Al/n-Si heterojunctions prepared by magnetron sputtering

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Cited by 50 publications
(17 citation statements)
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“…5(b)), is consistent with standard one, largely reported in many works [32,33] and it reflects the presence of surface channel current component [34]. This transport current is generally well expected in porous silicon-based structures, since the rapid expected-oxidation during structure growth [35][36][37][38][39].…”
Section: Current-voltage Characteristics Of Izo/ps/si and Izo/zno/ps/supporting
confidence: 86%
“…5(b)), is consistent with standard one, largely reported in many works [32,33] and it reflects the presence of surface channel current component [34]. This transport current is generally well expected in porous silicon-based structures, since the rapid expected-oxidation during structure growth [35][36][37][38][39].…”
Section: Current-voltage Characteristics Of Izo/ps/si and Izo/zno/ps/supporting
confidence: 86%
“…The dominant transport mechanism can be determined by studying the temperature dependence of this parameter [16][17][18][19][20][21]. If parameter B is temperature dependent, the dominant transport mechanism is either diffusion in the case of n 1 = or recombination when n 1 2.…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, it is almost certainly that the barrier is not linear, we have neglected the changes in the density of states and their population with temperature [21]. Even so, we can solved this in-coincidence by considering the multi-tunneling capture-emission mechanism (MTCE) instead of the multi-tunneling model studied by Matsuura et al [23], and Song et al [6], that combine the thermal transport mechanism and tunneling transport mechanism. The values of activation energy (E a ) of the saturation current, deduced from the linear fit of data in Fig.…”
Section: Current-voltage Characteristicsmentioning
confidence: 99%
“…Thin films and hetero-junctions of semiconductors have been elaborated by different methods like thermal evaporation [5], magnetron sputtering [6], vapor liquid solid (VLS) method [7], pulsed laser deposition [8], sol gel process [9] and ultrasonic spray pyrolysis [10]. The last method has some advantages for producing thin films, such as the simplicity and low cost.…”
Section: Introductionmentioning
confidence: 99%