2012
DOI: 10.1016/j.commatsci.2012.07.006
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Structural characterization of III–V zinc blende compound semiconductors using Monte Carlo simulations

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Cited by 9 publications
(9 citation statements)
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“…Simulations, performed with the classic MMC algorithm, i.e. with η = 1.0, were found to be comparable with the values in [8]. All obtained data points clearly indicate a significant improvement compared with previously published data.…”
Section: Comparison For Different Iii–v Materialssupporting
confidence: 78%
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“…Simulations, performed with the classic MMC algorithm, i.e. with η = 1.0, were found to be comparable with the values in [8]. All obtained data points clearly indicate a significant improvement compared with previously published data.…”
Section: Comparison For Different Iii–v Materialssupporting
confidence: 78%
“…The structural properties of common elemental and III-V semiconductors, which crystallise in a diamond or zincblende lattice, can be modelled at an atomistic level using the Tersoff potential, where parameter sets are readily available [5][6][7][8]. These potentials were also proven to be reliable regarding the elastic behaviour or bond length distributions in binary compounds as well as random and spontaneously ordered ternary structures [9][10][11][12].…”
mentioning
confidence: 99%
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“…The empirical interaction potential form was proven to be reliable for binary III-V materials [D. Powell et al (2007); P. Rathi et al (2012)]. However, ternary alloys which can be lattice-matched to InP substrates, recently gained technological relevance for a wide range of applications [C.R.…”
Section: Introductionmentioning
confidence: 98%
“…Since effects like interface roughness scattering or dopant migration can influence the characteristics of electronic devices significantly, optimized models, which include an accurate The structural model, presented in this work, is suitable for III-V semiconductor materials, which are applied in a wide range of electronic and optoelectronic devices. The empirical interaction potential form was proven to be reliable for binary III-V materials [D. Powell et al (2007); P. Rathi et al (2012)]. However, ternary alloys which can be lattice-matched to InP substrates, recently gained technological relevance for a wide range of applications [C.R.…”
Section: Introductionmentioning
confidence: 98%