2009
DOI: 10.1080/00150190902987699
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Structural and Piezoelectric Properties of DC-Sputtered AlN Films Deposited on Different Si-Based Substrates

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Cited by 3 publications
(2 citation statements)
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“…In most of the previous work sapphire, Silicon or SiC was used as the substrate, but it is believed that Si/Si3N4 substrate provides further flexibility in the development of Si-based technological applications [12]. PLD in particular lends itself to low temperature processing because the average energy of particles in the laser-evaporated plume is considerably higher (10 eV) than the thermal evaporation energy (0.1 eV).…”
mentioning
confidence: 99%
“…In most of the previous work sapphire, Silicon or SiC was used as the substrate, but it is believed that Si/Si3N4 substrate provides further flexibility in the development of Si-based technological applications [12]. PLD in particular lends itself to low temperature processing because the average energy of particles in the laser-evaporated plume is considerably higher (10 eV) than the thermal evaporation energy (0.1 eV).…”
mentioning
confidence: 99%
“…Among all its properties, the high sound velocity makes AlN a promising candidate for high-frequency surface acoustic wave (SAW) devices [2][3][4], in comparison with the conventional SAW material as LiNbO 3 , LiTaO 3 or quartz. There are many deposition techniques employed for obtaining high-quality (c-axis-oriented or single-crystalline) AlN thin films on various substrates, such as pulsed laser deposition [5], chemical vapor deposition [6], molecular beam epitaxy [7] and direct current or radio frequency (RF) sputtering [8][9][10][11][12][13][14][15]. The most commonly used technique is sputtering because it is possible to obtain good orientation and uniform films close to single-crystal morphology even at low substrate temperature or on amorphous substrate with easier fabrication [16].…”
Section: Introductionmentioning
confidence: 99%