Structural and dielectric properties of CuO nanoparticles

Oruç, Çiğdem; Altındal, Ahmet

doi:10.1016/j.ceramint.2017.05.006

Cited by 126 publications

(49 citation statements)

References 38 publications

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“…The XPS testing also indicated that there was certain oxidation on the resultant metal layer after the Cu layer was exposed in air for 5 h, which was ascribed to a normal self-passivated oxidation and did not affect the conductive stability of the metal layer (Figure S20, Supporting Information). [46] As revealed by SEM, the Pd 2+ -catalyzed metal deposition resembled a tight arrangement of bubbles that was similar to that of the Kelvin structure model (Figure 3b-d). [47] The corresponding deposition process followed the empirical topology law of Aboav-Weaire (Figure S21, Supporting Information); [48] it started from the interfacial catalytic formation of metal clusters (e.g., Cu, Ni) and was followed by the competitive growth and extrusion of adjacent metal clusters to form an energy-minimizing foamlike structure (Figure 3c,d).…”

Section: Resultssupporting

confidence: 69%

Crack Suppression in Conductive Film by Amyloid‐Like Protein Aggregation toward Flexible Device

et al. 2021

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The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adma.202104187.A fatal weakness in flexible electronics is the mechanical fracture that occurs during repetitive fatigue deformation; thus, controlling the crack development of the conductive layer is of prime importance and has remained a great challenge until now. Herein, this issue is tackled by utilizing an amyloid/ polysaccharide molecular composite as an interfacial binder. Sodium alginate (SA) can take part in amyloid-like aggregation of the lysozyme, leading to the facile synthesis of a 2D protein/saccharide hybrid nanofilm over an ultralarge area (e.g., >400 cm 2 ). The introduction of SA into amyloid-like aggregates significantly enhances the mechanical strength of the hybrid nanofilm, which, with the help of amyloid-mediated interfacial adhesion, effectively diminishes the microcracks in the hybrid nanofilm coating after repetitive bending or stretching. The microcrack-free hybrid nanofilm then shows high interfacial activity to induce electroless deposition of metal in a Kelvin model on a substrate, which noticeably suppresses the formation of microcracks and consequent conductivity loss during the bending and stretching of the metal-coated flexible substrates. This work underlines the significance of amyloid/polysaccharide nanocomposites in the design of interfacial binders for reliable flexible electronic devices and represents an important contribution to mimicking amyloid and polysaccharide-based adhesive cements created by organisms.

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Section: Resultssupporting

confidence: 69%

Crack Suppression in Conductive Film by Amyloid‐Like Protein Aggregation toward Flexible Device

et al. 2021

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“…Recently, CuO was modified by Au [22], Fe [23], Li [23,24], Na [24], Pd [25], Pt [26], Px (Piroxicam) [27], Ag [28], Cr [28], Sb [28], and Si [28]. Various techniques have been studied to deposit CuO ( Figure 2), for example: magnetron sputtering [22,[28][29][30][31][32], sol-gel [33], thermal oxidation [14,34], hydrothermal techniques [4,5,15,20,21,[35][36][37], hydrothermal techniques with the electrospinning method [38,39], the spray pyrolysis technique [40], the microwave-assisted method [41], electron beam irradiation [42], microplasma synthesis [43], and successive ionic layer adsorption and reaction (SILAR) [44]. In [28], the author presented M-doped CuO-based thin film deposited using magnetron sputtering technology, which is a typical physical vapor deposition (PVD) technique.…”

Section: Copper Oxides' Compositions and Deposition Techniquesmentioning

confidence: 99%

“…The starting solution, an aqueous solution containing copper chloride CuCl 2 , was used, being a source of copper, heated to a specific temperature to increase the solubility of various constituents, and then deposited on glass substrates using spray pyrolysis. Various methods allow obtaining copper oxides with different morphologies, including nanowires [44,46], nanoparticles [33,47], nanoflowers [26,48], nanofibers [38,49], nanorods [50,51], nanostructures [35,36,42], nanobelts [24], hollow spheres [8,23], and nanosheets [52]. Table 1 lists various deposition techniques and nanoscale forms of CuO-based gas sensors.…”

Section: Copper Oxides' Compositions and Deposition Techniquesmentioning

confidence: 99%

The Use of Copper Oxide Thin Films in Gas-Sensing Applications

Rydosz

2018

Coatings

109

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In this work, the latest achievements in the field of copper oxide thin film gas sensors are presented and discussed. Several methods and deposition techniques are shown with their advantages and disadvantages for commercial applications. Recently, CuO thin film gas sensors have been studied to detect various compounds, such as: nitrogen oxides, carbon oxides, hydrogen sulfide, ammonia, as well as several volatile organic compounds in many different applications, e.g., agriculture. The CuO thin film gas sensors exhibited high 3-S parameters (sensitivity, selectivity, and stability). Furthermore, the possibility to function at room temperature with long-term stability was proven as well, which makes this material very attractive in gas-sensing applications, including exhaled breath analysis.

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“…The uncoated bioelectrode presented the largest impedance value and the amplitude of impedance was as high as 34 kΩ. It may be attributed that an insulating oxide layer was produced on the bioelectrode surface [47][48]. The existence of the oxide layer coating greatly increased the impedance value.…”

Section: Impedance Of Bioelectrodes With Different Surface Coatingsmentioning

confidence: 99%

Electrical impedance performance of metal dry bioelectrode with different surface coatings

Liu

Zhou

Liu

et al. 2018

Sensors and Actuators A: Physical

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To improve the electrical impedance performance of bioelectrodes, a novel metal dry bioelectrodes with different coating layers are developed with laser micromilling and electroplating technology. Based on the analysis of the coating layer on the bioelectrode surface, the effect of different coating layers on the electrical impedance performance of bioelectrodes is investigated. The results show that the silver content increases with electroplating time when the silver layer is coated on the bioelectrode surface. However, the decrease of silver layer weight is observed with much longer electroplating time, and the optimal electroplating time is 20 min. Compared with the uncoated bioelectrode, the bioelectrode coated with silver layer exhibits much lower impedance value and better impedance stability. Especially, when the silver-coated bioelectrode is subsequently coated with silver-silver chloride layer, the lowest impedance value and best impedance stability are obtained

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Structural and dielectric properties of CuO nanoparticles

Cited by 126 publications

References 38 publications

Crack Suppression in Conductive Film by Amyloid‐Like Protein Aggregation toward Flexible Device

Crack Suppression in Conductive Film by Amyloid‐Like Protein Aggregation toward Flexible Device

The Use of Copper Oxide Thin Films in Gas-Sensing Applications

Electrical impedance performance of metal dry bioelectrode with different surface coatings

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