Stress–temperature behavior of unpassivated thin copper films

Keller, R.; Baker, Shefford P.; Arzt, Eduard

doi:10.1016/s1359-6454(98)00387-5

Cited by 126 publications

(65 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In this case, stress can be imposed on the film by changing the temperature of the system. [4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] The constraint of the substrate implies that the generated thermal strain is essentially offset by the generation of some combination of elastic and plastic strain in the film. If is the equi-biaxial stress in the film, and p is the equi-biaxial plastic strain, then rates of change are related by /M ϩ p ϩ (␣ film Ϫ ␣ sub )Ṫ 0,…”

Section: Measuring Plastic Deformationmentioning

confidence: 99%

Dislocation Plasticity in Thin Metal Films

Kraft¹,

Freund²,

Phillips³

et al. 2002

MRS Bull.

Self Cite

View full text Add to dashboard Cite

This article describes the current level of understanding of dislocation plasticity in thin films and small structures in which the film or structure dimension plays an important role. Experimental observations of the deformation behavior of thin films, including mechanical testing as well as electron microscopy studies, will be discussed in light of theoretical models and dislocation simulations. In particular, the potential of applying strain-gradient plasticity theory to thin-film deformation is discussed. Although the results of all studies presented follow a "smaller is stronger" trend, a clear functional dependence has not yet been established.

show abstract

Section: Measuring Plastic Deformationmentioning

confidence: 99%

Dislocation Plasticity in Thin Metal Films

Kraft¹,

Freund²,

Phillips³

et al. 2002

MRS Bull.

Self Cite

View full text Add to dashboard Cite

show abstract

“…As a result, metal thin films, which are key components in these devices, have been studied extensively. These investigations have demonstrated that the mechanical properties of thin films are generally very different from those of their bulk counterparts [1][2][3][4][5][6][7][8][9][10][11] and that they depend on whether the film is freestanding or supported by a substrate [12][13][14][15]. Understanding the mechanical behavior of metal thin films at elevated temperature is essential for the design of reliable devices, which often operate above room temperature.…”

Section: Introductionmentioning

confidence: 99%

“…Understanding the mechanical behavior of metal thin films at elevated temperature is essential for the design of reliable devices, which often operate above room temperature. Several studies have been performed on the high-temperature behavior of films on substrates [2,[16][17][18][19], but studies on freestanding films have been limited to temperatures below 200ºC [20][21][22][23] due to difficulties associated with sample handling, oxidation, and temperature uniformity in the sample. The few studies performed at higher temperatures focused on films that were several microns thick [24][25][26].…”

Section: Introductionmentioning

confidence: 99%

High-temperature tensile behavior of freestanding Au thin films

Sim

Vlassak

2014

Scripta Materialia

View full text Add to dashboard Cite

The mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperatures up to 340°C using tensile testing. Films tested at elevated temperatures exhibit a significant decrease in flow stress and stiffness. Furthermore the flow stress decreases with decreasing film thickness, contravening the usual notion that "smaller is stronger". This behavior is attributed mainly to diffusion-facilitated grain boundary sliding.Keywords: In situ tensile test, High-temperature deformation, Thin films, Grain boundary sliding, Creep IntroductionThe decreasing size of microelectronics devices has motivated a strong interest in the effects of length scales on the mechanical behavior of thin films of metal. As a result, metal thin films, which are key components in these devices, have been studied extensively. These investigations have demonstrated that the mechanical properties of thin films are generally very different from those of their bulk counterparts [1][2][3][4][5][6][7][8][9][10][11] and that they depend on whether the film is freestanding or supported by a substrate [12][13][14][15]. Understanding the mechanical behavior of metal thin films at elevated temperature is essential for the design of reliable devices, which often operate above room temperature. Several studies have been performed on the high-temperature behavior of films on substrates [2,[16][17][18][19], but studies on freestanding films have been limited to temperatures below 200ºC [20][21][22][23] due to difficulties associated with sample handling, oxidation, and temperature uniformity in the sample. The few studies performed at higher temperatures focused on films that were several microns thick [24][25][26]. Thus, the high-temperature behavior of freestanding metal thin films is still relatively unexplored. Recently, we developed a technique for the tensile testing of freestanding thin films in which samples were mounted on a micro-machined silicon frame with integrated heaters [27]. The samples were deformed in-situ inside a scanning electron microscope (SEM) by means of a custom-built test apparatus. Using this technique, the stress-strain curves of copper thin films were measured at temperatures up to 430°C. In this paper, the same technique is used to characterize the mechanical behavior of gold films as a function of temperature and strain rate. Gold was chosen as the material of interest due to its oxidation resistance and low electrical resistivity. The oxidation resistance makes gold an interesting material for studying the inherent mechanical behavior at elevated temperature without the added complication of a passivation

show abstract

“…Monitoring changes in the curvature of film-on-substrate assemblies during heating and cooling can furnish the in-plane stressstrain response of single layer films. [13][14][15] However, the average film response is obtained rather than that of the individual constituents. Instead, we use in situ X-ray diffraction during heating/cooling.…”

Section: Abstract: Nanolaminates X-ray Diffraction Interface Propermentioning

confidence: 99%