Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy

Meszmer, Peter; Rodriguez, Raúl D.; Sheremet, Evgeniya; Zahn, Dietrich R. T.; Wunderle, Bernhard

doi:10.1016/j.microrel.2017.10.010

Cited by 9 publications

(9 citation statements)

References 22 publications

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“…As of this, even the scaling factor may vary. The documented stress sensitivity is below 20 MPa even for geometrically challenging MEMS structures, whereas a limit of 10 MPa is given in the study (Figure ).…”

Section: Micro‐ and Nanomechanical Stress And Strain Measurementsmentioning

confidence: 68%

“…The need for characterization of stress (a physical quantity that aggregates the internal forces per area between infinitesimal constituents of a material, unit Pa) and strain (as the relative deformation of N/MEMS components, dimensionless) on a micro‐ and nanoscopic scale is manifold. The recent examples of application scenarios include, but are not limited to the determination of stress and strain for material characterization, calibration of evaluation algorithms of MEMS sensors, or the measurement of stress and strain in integrated circuits during or after fabrication . While moving forward in miniaturization, stress and strain characterization on the true nanoscopic spatial scale becomes important to understand the properties and the behavior of potentially new materials and their interfaces; e.g., in the case of CNTs, it is known that the embedding itself affects the mechanical behavior of their interfaces .…”

Section: Micro‐ and Nanomechanical Stress And Strain Measurementsmentioning

confidence: 99%

“…To reach high sensitivities below 20 MPa, not only highly sensitive equipment is needed, but also sophisticated post‐processing of the acquired data is necessary as described in our earlier study . Instead of averaging among spectra to smoothen the data, every spectrum is analyzed and appropriate functions are fitted to the peaks of interest, e.g., Si and plasma peaks.…”

Section: Micro‐ and Nanomechanical Stress And Strain Measurementsmentioning

confidence: 99%

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Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales

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The present study covers the nanoanalysis methods for four key material characteristics: electrical and electronic properties, optical, stress and strain, and chemical composition. With the downsizing of the geometrical dimensions of the electronic, optoelectronic, and electromechanical devices from the micro to the nanoscale and the simultaneous increase in the functionality density, the previous generation of microanalysis methods is no longer sufficient. Therefore, the metrology of materials' properties with nanoscale resolution is a prerequisite in materials' research and development. The article reviews the standard analysis methods and focuses on the advanced methods with a nanoscale spatial resolution based on atomic force microscopy (AFM): current-sensing AFM (CS-AFM), Kelvin probe force microscopy (KPFM), and hybrid optical techniques coupled with AFM including tip-enhanced Raman spectroscopy (TERS), photothermal-induced resonance (PTIR) characterization methods (nano-Vis, nano-IR), and photo-induced force microscopy (PIFM). The simultaneous acquisition of multiple parameters (topography, charge and conductivity, stress and strain, and chemical composition) at the nanoscale is a key for exploring new research on structure-property relationships of nanostructured materials, such as carbon nanotubes (CNTs) and nano/microelectromechanical systems (N/MEMS). Advanced nanocharacterization techniques foster the design and development of new functional materials for flexible hybrid and smart applications.

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Section: Micro‐ and Nanomechanical Stress And Strain Measurementsmentioning

confidence: 68%

Section: Micro‐ and Nanomechanical Stress And Strain Measurementsmentioning

confidence: 99%

Section: Micro‐ and Nanomechanical Stress And Strain Measurementsmentioning

confidence: 99%

See 1 more Smart Citation

Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales

Sheremet

Meszmer

Blaudeck

et al. 2019

Physica Status Solidi (a)

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“…Following a SCA implies that the processes required to create a loading stage have to be compatible with the process flow of the sample. In previous publications, the authors have presented and discussed the principles of SCA compatible test stages and building blocks of such test devices, which can be fitted to different types of samples and testing environments. The SCA idea and concept has been used by different research groups, as shown in refs.…”

Section: Introductionmentioning

confidence: 99%

Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements − Technology and Functional Test Results

Meszmer

Hahn

Hiller

et al. 2019

Physica Status Solidi (a)

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This paper reports on concepts, technology, integration aspects, and results of a MEMS-based test platform for reliability tests of micro and nano objects.Building blocks of this platform to be used in in-plane push-pull-configurations are a thermal actuator, a force sensor, and a displacement sensor as well as several types of samples to be integrated directly or indirectly. The technology concept is proven for aluminum wires as a first demonstrator for an integrated specimen. The modular concept enables the adoption of the platform for further types of samples and test configurations. The building blocks are simulated using a Finite-Element approach and the results are compared to experimentally obtained data sets. According to the specifications, the thermal actuator is capable of providing displacements up to 1.5 μm. The displacement and the force sensor are specified to provide sensitivities of 3 fF nm À1 and 2.5 μV nN À1 , respectively. SEM image of a piezoresistive force sensor attached to an integrated Al wire as test sample À building blocks of MEMS-based test platforms.

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mentioning

confidence: 99%

Sensoric Micro and Nano Systems

Zahn

Schulz

Hiller

et al. 2019

Physica Status Solidi (a)

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Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy

Cited by 9 publications

References 22 publications

Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales

Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales

Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements − Technology and Functional Test Results

Sensoric Micro and Nano Systems

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