2019
DOI: 10.1002/pssa.201800936
|View full text |Cite
|
Sign up to set email alerts
|

Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements − Technology and Functional Test Results

Abstract: This paper reports on concepts, technology, integration aspects, and results of a MEMS-based test platform for reliability tests of micro and nano objects.Building blocks of this platform to be used in in-plane push-pull-configurations are a thermal actuator, a force sensor, and a displacement sensor as well as several types of samples to be integrated directly or indirectly. The technology concept is proven for aluminum wires as a first demonstrator for an integrated specimen. The modular concept enables the … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
4
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
4
1

Relationship

3
2

Authors

Journals

citations
Cited by 5 publications
(5 citation statements)
references
References 29 publications
0
4
0
Order By: Relevance
“…Still, large amounts of characterization and testing are required to characterize for device reliability. Such reliability tests can be achieved by the SCA, as, e.g., promoted by Meszmer et al Together with nanocharacterization, this gives insights into the nanoscopic failure mechanisms for CNT metal contacts …”
Section: Discussionmentioning
confidence: 97%
See 1 more Smart Citation
“…Still, large amounts of characterization and testing are required to characterize for device reliability. Such reliability tests can be achieved by the SCA, as, e.g., promoted by Meszmer et al Together with nanocharacterization, this gives insights into the nanoscopic failure mechanisms for CNT metal contacts …”
Section: Discussionmentioning
confidence: 97%
“…This implies that the processes required to create a loading stage have to be compatible with the process flow of heterogeneous integration of nanofunctional elements. Bonding and deep reactive ion etching in combination with multilayer silicon on insulator wafers has proven itself as the versatile method of choice . A given test stage comprises a capacitive displacement sensor, a thermal actuator, and a piezoresistive force sensor .…”
Section: Cnt Strain Sensor Technologymentioning
confidence: 99%
“…Since the failure of either the zero bias or scale factor indicates a failure of the MEMS gyroscope rotor system [27], we defined the failure time for parameter degradation in a vibrational environment as T = min(T 1 , T 2 ). Here, T 1 represents the failure time of the MEMS gyroscope rotor's zero bias, and T 2 represents the failure time of the scale factor [28].…”
Section: Reliability Evaluation Of Mems Gyroscope Rotor Parameter Deg...mentioning
confidence: 99%
“…In the present article, we will highlight the developments in nanocharacterization for CNT and CNT‐based devices for 1) CNT‐based vertical interconnects, or vias (vertically aligned CNTs acting as nanostructured conductor); 2) CNT‐based field‐effect transistors (CNTFETs) with CNTs as planar semiconducting transistor channel; and 3) monolithic microelectromechanical systems (MEMS) with mechanical interfaces to integrate CNTs and other nanomaterials in hybrid NEMS. The latter can even act as an entirely new class of test platforms for the micro–nano interface …”
Section: Introductionmentioning
confidence: 99%