2009
DOI: 10.1016/j.compositesa.2009.02.006
|View full text |Cite
|
Sign up to set email alerts
|

Stress and dislocations in diamond–SiC composites sintered at high pressure, high temperature conditions

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
7
0

Year Published

2011
2011
2024
2024

Publication Types

Select...
9

Relationship

0
9

Authors

Journals

citations
Cited by 19 publications
(7 citation statements)
references
References 23 publications
0
7
0
Order By: Relevance
“…This crack deflection will consume a lot of energy and eventually increase the toughness 8,64 . In addition, since dislocations are formed around the reinforcing particles, if the crack encounters these dislocations in its growth path, it inevitably shows a path deviation 65,66 . Overall, these factors have improved the fracture toughness by increasing the reinforcing particles to 5 wt.% of nano β-SiC and 1 wt.% of graphene (Fig.…”
Section: Toughnessmentioning
confidence: 99%
“…This crack deflection will consume a lot of energy and eventually increase the toughness 8,64 . In addition, since dislocations are formed around the reinforcing particles, if the crack encounters these dislocations in its growth path, it inevitably shows a path deviation 65,66 . Overall, these factors have improved the fracture toughness by increasing the reinforcing particles to 5 wt.% of nano β-SiC and 1 wt.% of graphene (Fig.…”
Section: Toughnessmentioning
confidence: 99%
“…After the milling process, a refined microstructure is obtained with a small crystallite size and high microstrain values; this nanostructured state is induced by the severe deformation accumulated during the milling of the Al matrix [24]. At this stage of the process, the C phase acts as a control agent process preventing the excessive cold welding of the Al particles during the milling process [19]. After the sintering process, the crystallite size grows, and the C phase transforms into the Al 4 C 3 nanophase.…”
Section: Microstructural Analysismentioning
confidence: 99%
“…The existing methods for preparing Dia/SiC composites include high-temperature and high-pressure (HTHP) sintering [ 9 , 10 ], precursor conversion [ 11 ], vacuum discharge plasma sintering [ 12 ], and hot isostatic pressing [ 8 , 13 ]. The application of hot isostatic pressing and HTHP sintering methods to prepare composite materials is limited by their expensive equipment [ 14 ].…”
Section: Introductionmentioning
confidence: 99%