Investigation of the Fabrication of Diamond/SiC Composites Using α-Si3N4/Si Infiltration
Bo Xing,
Yingfan Zhang,
Jinzhui Zhao
et al.
Abstract:Diamond/SiC (Dia/SiC) composites possess excellent properties, such as high thermal conductivity and low thermal expansion coefficient. In addition, they are suitable as electronic packaging materials. This study mainly optimized the diamond particle size packing and liquid-phase silicon infiltration processes and investigated a method to prevent the adhesion of the product to molten silicon. Based on the Dinger–Funk particle stacking theory, a multiscale diamond ratio optimization model was established, and t… Show more
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