2020
DOI: 10.1016/j.apsusc.2020.146016
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Strain relaxation, extended defects and doping effects in InxGa1-xN/GaN heterostructures investigated by surface photovoltage

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Cited by 3 publications
(2 citation statements)
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“…There is an increasing demand for robust structural and electrical characterization at the nanoscale to improve our understanding of current transport in ultrascaled devices and low-dimensional nanostructures for a broad range of applications in logic, nonvolatile memory, and optoelectronics. Some of the notable examples include quantitative analysis of ultrashallow junctions in field effect transistors, reconfigurable ferroelectric domain walls, trapping/de-trapping of defects in III-Vs, and so forth by various modes of scanning probe techniques. In this context, a nanometer-sized probe and the versatile nature of atomic force microscopy (AFM) can offer the required high resolution.…”
Section: Introductionmentioning
confidence: 99%
“…There is an increasing demand for robust structural and electrical characterization at the nanoscale to improve our understanding of current transport in ultrascaled devices and low-dimensional nanostructures for a broad range of applications in logic, nonvolatile memory, and optoelectronics. Some of the notable examples include quantitative analysis of ultrashallow junctions in field effect transistors, reconfigurable ferroelectric domain walls, trapping/de-trapping of defects in III-Vs, and so forth by various modes of scanning probe techniques. In this context, a nanometer-sized probe and the versatile nature of atomic force microscopy (AFM) can offer the required high resolution.…”
Section: Introductionmentioning
confidence: 99%
“…The value of C high was chosen by comparing the most common n-GaN devices, consulting several references, [24][25][26] and approaching the doping values of the study by Zhang et al 35 Here, R p/n is the ratio between p-GaN and n-GaN concentrations, serving as a proportion indicator between carriers to correlate electrical and optical properties in the device, see Table I. Although a high impurity concentration (Si or Mg) inside any compound semiconductor results in epilayer morphology degradation and surface roughness, the small indium content and low Si impurities used in our study avoids concerns on this issue as discussed by Cavalcoli et al 36 The high amount of Mg impurities in our case also does not affect the surface morphology due to the small thickness of the n-GaN layer used here. For thicker layers, a proper carrier gas technique during growth can be used to smooth the surface and avoid the Mg diffusion into the active layer.…”
mentioning
confidence: 98%