The characterization of the fabrication process to develop free-standing SU-8 structures integrated in PCBMEMS (Printing Circuit Board in Microelectromechanical Systems) technology is presented. SU-8 microcantilevers, microbridges, microchannels and micromembranes have been fabricated following the described procedure. Adherence between FR4 substrate and SU-8 has been studied using the destructive blister method, determining the surface energy. Residual thermal stress has also been analyzed for this integration and compared when using other substrates. Moreover, a study of the copper wet etching with cupric chloride has been performed in order to characterize how this isotropic etching affects the geometry of the copper structures. Finally, stiction has been observed and examined, determining the adhesion energy responsible of this effect.