Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146)
DOI: 10.1109/iemt.2000.910722
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Stacked Half-Milli CSP

M. Chino1,
Keichiro Tsuchihashi2,
K. Miyajima3
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Ultra thin chips for miniaturized products

Jung
1
,
Neumann
2
,
Wojakowski
3
et al.
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
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Ultra thin chips for miniaturized products

Jung
1
,
Neumann
2
,
Wojakowski
3
et al.
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
16
0
3
0
View full textAdd to dashboardCite

An extremely thin BGA format chip-scale package and its board level reliability

Yoshida
1
,
Kim
2
,
Ishibashi3
et al.
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
6
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1
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Manufacturing issues for 3D integrated active circuits into organic laminate substrates

Jung
1
,
Wojakowski
2
,
Neumann
3
et al. 2003
IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.
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