Ultra thin chips for miniaturized products

Jung, E.; Neumann, Alexander; Wojakowski, D.; Ostmann, A.; Landesberger, Christof; Aschenbrenner, R.; Reichl, H.

doi:10.1109/ectc.2002.1008241

Cited by 16 publications

(3 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Figure 1 represents the International Technology Roadmap for Semiconductors (ITRS), according to which the wafer thickness and the wafer size will increase while an opposite trend is observed for the die thickness 1 . The cost reduction achieved due to the increase in the wafer size is the driving force behind this trend.…”

Section: Introductionmentioning

confidence: 99%

“…However, with continuous demand for miniaturization in consumer products, the total package needs to be as thin as possible. Recent advances in packaging technology require the silicon die to be as thin as possible [1,2]. Currently the silicon die is thinned to 150 µm but demand for die thickness of 50 µm or less will be the norm in the coming years.…”

Section: Introductionmentioning

confidence: 99%

“…The choice of method is dependent on the final device application. The main issues in silicon thinning are 1 http://www.itrs.net/Common/2005ITRS/Home2005.htm. thickness uniformity, surface roughness, crystal damage, bow and stresses in the wafer.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Microstructural, mechanical, fractural and electrical characterization of thinned and singulated silicon test die

Majeed¹,

Paul²,

Razeeb³

et al. 2006

J. Micromech. Microeng.

View full text Add to dashboard Cite

This paper investigates the effects of thinning on different properties of silicon test die. Silicon test wafers of different thicknesses (525, 250, 100 and 50 µm) were thinned using a mechanical grinding process. The wafers were diced by using a specialized dicing saw and by a laser to study the effect of singulation. The laser dicing adversely affected the mechanical properties, while the fracture strength and flexibility increased with a reducing die thickness for mechanical grind test die. Fractured dies were macro and microscopically examined indicating different modes of failure depending on the fracture load. The electrical parameters of the test die were investigated and showed no adverse affect on the properties due to the thinning process.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%