Manufacturing issues for 3D integrated active circuits into organic laminate substrates

Jung, E.; Wojakowski, D.; Neumann, Alexander; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

doi:10.1109/iemt.2003.1225915

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. 2003

DOI: 10.1109/iemt.2003.1225915

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Manufacturing issues for 3D integrated active circuits into organic laminate substrates

E. Jung

D. Wojakowski

Alexander Neumann

et al.

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Manufacturing issues for 3D integrated active circuits into organic laminate substrates

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