Spray coating of photoresist for pattern transfer on high topography surfaces

Pham, Nga; Burghartz, Joachim N.; Sarro, P.M.

doi:10.1088/0960-1317/15/4/003

Cited by 106 publications

(73 citation statements)

References 6 publications

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“…Such droplets stick to the substrate at any location they arrive, making this technology ideal for side-wall coverage of high aspect ratio micro and nanostructures on a substrate. Figure 3.79 offers a schematic representation of a spray system [134][135][136]. An ultrasonic nozzle creates the droplets.…”

Section: Spray-coatingmentioning

confidence: 99%

Deposition Technologies

Gatzen¹,

Saile²,

Leuthold³

2015

Micro and Nano Fabrication

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Deposition of thin-films used in MEMS and NEMS devices rely on a wide variety of technologies. Physical vapor deposition (PVD) uses physical effects like evaporation or ion bombardment to create thin-films on a substrate by forcing source atoms into a gaseous phase. Chemical vapor deposition (CVD) and similar processes create coatings by a chemical reaction of volatile species by using reaction processes defined by chemical reaction equations. While PVD and CVD are dry processes, for depositing conductive thin-films the substrate may be submerged in an electrically conductive liquid (an electrolyte) and subjected to electrochemical or chemical deposition. Spin-coating and spray-coating are two examples of technologies that lend themselves to creating organic films-a technology widely used in depositing photoresists in photolithography. Dip processes like solgel may be used for the creation of oxide coatings.

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Section: Spray-coatingmentioning

confidence: 99%

Deposition Technologies

Gatzen¹,

Saile²,

Leuthold³

2015

Micro and Nano Fabrication

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“…Spray coating is known to yield variations in the thickness of the deposited layer across sharp edges of etched cavities [16]. We investigate the results of a nonuniform photoresist layer by measuring the line patterns transferred in silicon nitride.…”

Section: Variations In Photoresist Thicknessmentioning

confidence: 99%

Photolithography on bulk micromachined substrates

Venstra¹,

Spronck²,

Sarro³

et al. 2009

J. Micromech. Microeng.

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Photolithography on high topography substrates, such as the sidewalls or the bottom of cavities and trenches created by bulk micromachining, enables the design of complex three-dimensional structures. When a contact lithography system is used to pattern such substrates, local gaps exist between the mask and the substrate. In this paper we investigate the deformation of patterns as a result of these local gaps. We determine the position accuracy and the minimum size of features that can be patterned as a function of the gap distance. Deformations introduced by the optical system are quantified for a common exposure tool, and compared to pattern deformation due to variations in photoresist layer thickness. Finally, methods to improve the quality of patterns transferred through gaps up to 350 μm are discussed.

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“…A different resist-deposition technique was inevitable. Conformal resist deposition on non-planar substrates can be achieved by spraying [11], electro-deposition [12,13], plasma deposition, etc. We opted for a simple ''float-coating'' technique first demonstrated by Zhou et al [14].…”

Section: Micromachining Of Pyramidsmentioning

confidence: 99%