Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties

Alayli, Nadim; Schoenstein, Frédéric; Girard, A.; Tan, Ky-Lim; Dahoo, Pierre‐Richard

doi:10.1016/j.matchemphys.2014.07.021

Cited by 20 publications

(11 citation statements)

References 28 publications

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“…In a recent study, a silver joint of 15 vol. % porosity reported a thermal conductivity of approximately 160 W/mK [71,73]. This result compares favorably with those shown in Fig.…”

Section: Inert Additives In the Micron Agsupporting

confidence: 87%

“…This layout overcame the limitations of current assisted sintering technology (CAST) that only sintered the copper disk with Ag paste to demonstrate their proof of principles [106]. In principle, this electrical-based sintering was similar to the spark plasma sintering (SPS) reported in the literature though the maximum voltage for the latter's techniques was 2 V [71]. An additional advantage of the former system over the SPS or CAST was the complete absence of pressure, and yet of comparable bonding quality [105].…”

Section: Routementioning

confidence: 87%

“…Nonmetallic fillers are assumed to be voids because of their low electrical conductivity. If such assumption is made and correlated to Ag joint of similar porosity (i.e., density of 55%) in the literature, the measured electrical conductivity of the sintered Ag joint was approximately 16 MS/m at 20 C and it decreased further to 10 MS/m at 200 C [71]. The reduced electrical conductivity was still better than those measured for Pb 92.5 Sn 5 Ag 2.5 solder joint that only has an electrical conductivity of 5 MS/m [72].…”

Section: Inert Additives In the Micron Agmentioning

confidence: 97%

“…In the case of thermal conductivity, the inclusion of inert additives is not as harmful as its reduction in electrical conductivity because these nonmetallic fillers (i.e., SiC and BN) have reasonable thermal conductivities [69]. Porosity of the Ag joint appears to be the only factor in determining the thermal conductivity because voids trap heat [71]. The pores reduce the thermal conductivities as much as 15% of its thermal conductivity for a Ag joint with 10 vol.…”

Section: Inert Additives In the Micron Agmentioning

confidence: 99%

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Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Siow

Lin

2016

Journal of Electronic Packaging

114

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Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill the operating conditions of wide band-gap (WBG) power device technologies. We review the current technology development of sintered Ag as a bonding material from the perspective of patents filed by various stakeholders since late 1980s. This review addresses the formulation of sintered pastes (i.e., nano-Ag, hybrid Ag, and micron Ag fillers), innovations in the process and equipment to form this Ag joint. This review will provide the insights and confidence to engineers, scientists from universities and industry as well as investors who are developing and commercializing the sintered Ag as a bonding material for microelectronic packaging.

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“…In a recent study, a silver joint of 15 vol. % porosity reported a thermal conductivity of approximately 160 W/mK [71,73]. This result compares favorably with those shown in Fig.…”

Section: Inert Additives In the Micron Agsupporting

confidence: 87%

Section: Routementioning

confidence: 87%

Section: Inert Additives In the Micron Agmentioning

confidence: 97%

Section: Inert Additives In the Micron Agmentioning

confidence: 99%

See 2 more Smart Citations

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Siow

Lin

2016

Journal of Electronic Packaging

114

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“…Generally, increase in SPS pressure results in better densification and higher relative density of metallic and alloyed parts fabricated by SPS [18,20,40,[46][47][48][49][50][51], as depictedin Fig. 6.…”

Section: Sps Pressurementioning

confidence: 99%

The densification behavior of metals and alloys during spark plasma sintering: A mini-review

Sovizi

Seraji

2019

SCI SINTER

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As of today, metals and alloys are widely utilized as structural, mechanical, electrical, and magnetic materials in every aspect of technology and industry. The complexity and diversity of metals applications emphasize the need for a new production method to quickly and easily manufacture metallic components. Spark plasma sintering as a new solidstate sintering method has been recently developed to respond to these needs. Up to now, numerous papers and researches have been published in the field of spark plasma sintering and its ability to manufacture metallic samples. Density is a significant property that has a great influence on the physical, mechanical, and functional properties of metallic parts. To the best of our knowledge, there is no concrete paper that reviews the densification behavior of metals and alloys during spark plasma sintering and the effect of its parameters on the density of metallic samples. As a result, this article dedicated to addressing this need. In this mini-review, after a short description of spark plasma sintering method, the effects of each sintering parameters on densification behavior of metals and alloys are studied, and possible physical and microstructural factors which have the effect of densification behavior of metallic samples at various sintering conditions are reviewed. Finally, the recent advances in finite element modeling, which study the temperature and stress inhomogeneity in the SPS process, have been reviewed in this paper.

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Silver Sintering and Soldering: Bonding Process and Comparison

Chen

Zhang

2019

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

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Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties

Cited by 20 publications

References 28 publications

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

The densification behavior of metals and alloys during spark plasma sintering: A mini-review

Silver Sintering and Soldering: Bonding Process and Comparison

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