Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Siow, Kim Shyong; Lin, Yi-Tsung

doi:10.1115/1.4033069

Cited by 120 publications

(20 citation statements)

References 48 publications

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“…As a result of this pressure-assisted process, a denser and more homogeneous layer was formed in C. In a previous study, the relationship between the sintering pressure and density of Ag sinter pastes was shown [30]. It is well-known that increased porosity diminishes thermal and electrical conductivities of sintered materials [31].…”

Section: Characterization and Measurementsmentioning

confidence: 99%

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

et al. 2021

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Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages.

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Section: Characterization and Measurementsmentioning

confidence: 99%

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

et al. 2021

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“…In the circumstance, sinter joining with Ag nanoparticles is now considered as a potential alternative to conventional solder alloys. 1,2) There have been, however, a few research reports released to the present on mechanical reliability of sintered Ag nanoparticles and there still remain many unclear points about the reliability. Recently, static characteristics of Ag nanoparticles are now being investigated through shearing tests of joint specimens 35) or mechanical tests with the use of film type specimens.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Fatigue Crack Propagation Behavior of Pressurized Sintered Ag Nanoparticles and Its Application to Thermal Fatigue Life Prediction of Sintered Joint

et al. 2019

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Fatigue crack propagation rate of pressure-sintered Ag nanoparticles was investigated and prediction method of fatigue crack propagation using strain energy density computed by FEM was proposed. The fatigue crack propagation rate was lower than that of pressureless-sintered Ag nanoparticles around ambient temperature. At high temperature, multiple small cracks occurred ahead of a main crack and they were connected with one another and the propagation rate of the main crack increased, so that properties of fatigue crack propagation in the high temperature region were close to those of pressureless-sintered Ag nanoparticles.As the inelastic strain energy density and the length of its acquisition area were inversely proportional, the prediction of fatigue crack propagation that do not depend on the size of the area was possible by the use of the proportional constant of the relationship. The behavior of thermal fatigue crack propagation of sintered joint structure that was predicted by the derived fatigue crack propagation law was mostly in agreement with experimental behavior. [

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“…Ag has received much attention from researchers, owing to its high electrical conductivity (6.30 × 10 7 S m −1 ) and thermal conductivity (427 W m −1 K −1 ) as compared with those of other metals [ 20 ]. In addition, AgNWs and Ag nanoparticles have been used in various fields, including catalysis [ 21 ], microelectronics [ 22 ] and thermally conductive composites [ 23 ].…”

Section: Introductionmentioning

confidence: 99%

Highly Thermal Conductive and Electrical Insulating Epoxy Composites with a Three-Dimensional Filler Network by Sintering Silver Nanowires on Aluminum Nitride Surface

Lee

Kim

2021

Polymers

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In this study, a new fabrication technique for three-dimensional (3D) filler networks was employed for the first time to prepare thermally conductive composites. A silver nanowire (AgNW)– aluminum nitride (AlN) (AA) filler was produced by a polyol method and hot-pressed in mold to connect the adjacent fillers by sintering AgNWs on the AlN surface. The sintered AA filler formed a 3D network, which was subsequently impregnated with epoxy (EP) resin. The fabricated EP/AA 3D network composite exhibited a perpendicular direction thermal conductivity of 4.49 W m−1 K−1 at a filler content of 400 mg (49.86 vol.%) representing an enhancement of 1973% with respect to the thermal conductivity of neat EP (0.22 W m−1 K−1). Moreover, the EP/AA decreased the operating temperature of the central processing unit (CPU) from 86.2 to 64.6 °C as a thermal interface material (TIM). The thermal stability was enhanced by 27.28% (99 °C) and the composites showed insulating after EP infiltration owing to the good insulation properties of AlN and EP. Therefore, these fascinating thermal and insulating performances have a great potential for next generation heat management application.

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Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Cited by 120 publications

References 48 publications

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Evaluation of Fatigue Crack Propagation Behavior of Pressurized Sintered Ag Nanoparticles and Its Application to Thermal Fatigue Life Prediction of Sintered Joint

Highly Thermal Conductive and Electrical Insulating Epoxy Composites with a Three-Dimensional Filler Network by Sintering Silver Nanowires on Aluminum Nitride Surface

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