2009
DOI: 10.1016/j.sna.2009.03.028
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Solvent assisted bonding of polymethylmethacrylate: Characterization using the response surface methodology

Abstract: This work presents the investigation of a solvent assisted bonding process developed for the fabrication of closed micro channels made from polymethylmethacrylate (PMMA). The effects of four processing parameters on the deformation and the bond strength of the micro channel have been investigated using the response surface methodology (RSM). High bond strengths (3.5 ± 0.8 MPa) at low deformations (1.6 ± 0.3 %) have been achieved at the center point of the design of experiment.

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Cited by 34 publications
(25 citation statements)
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“…The deformation percentage of the microchannel in the microfluidic chip (aspect ratio: 0.4) with isopropanol solvent is 2%-6%, and its bonding strength is 0.3 MPa [34]. The deformation percentages of the microchannel in the microfluidic chip (aspect ratio: 0.34 and 0.03) with ethylene glycol dimethacrylate is 1.6 ± 0.3% and 30%, respectively [32]. The bonding strengths with ethanol solvent (aspect ratio: 0.043) are 3.05-8.1 MPa, which are much stronger than those with other solvents or without the solvent bonding reported above.…”
Section: Influence Of Thermal Bonding Parametersmentioning
confidence: 99%
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“…The deformation percentage of the microchannel in the microfluidic chip (aspect ratio: 0.4) with isopropanol solvent is 2%-6%, and its bonding strength is 0.3 MPa [34]. The deformation percentages of the microchannel in the microfluidic chip (aspect ratio: 0.34 and 0.03) with ethylene glycol dimethacrylate is 1.6 ± 0.3% and 30%, respectively [32]. The bonding strengths with ethanol solvent (aspect ratio: 0.043) are 3.05-8.1 MPa, which are much stronger than those with other solvents or without the solvent bonding reported above.…”
Section: Influence Of Thermal Bonding Parametersmentioning
confidence: 99%
“…For the thermal bonding technique, which can obtain a higher bonding strength, the separation channel for gravitational field flow fractionation has a low depth/width, which is similar to those of microchips [31]. The deformation will remarkably increase with the reduction of the depth/width on the bonding microchips [32]. Although much has been learned about the fabrication of microchips, a cost-effective manufacturing method for gravitational field flow fractionation remains poorly realized.…”
Section: Open Accessmentioning
confidence: 99%
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“…Brown et al increased the hot-press bonding strength to 550 ± 30 N/cm 2 by utilizing the dimethyl sulfoxide (DMSO) miscible solution [28]. In further research of Umbrecht et al, the bonding strength was increased to 780 ± 100 N/cm 2 and the deformation was 9.2 ± 2.3% [31]. Organic solvent can seal the device independently, while the bonding strength declines.…”
Section: Comparison Of Different Bonding Processesmentioning
confidence: 99%
“…However, it is unsatisfactory here due to the possible structural damage caused by overly swelling. To reduce swelling damage, scholars proposed solvent assisted bonding method [28][29][30][31][32]. The organic solvents here are utilized for PMMA surface modification, the modified interface lead to a joint molecule diffusion zone when small pressure is applied on substrates.…”
Section: Introductionmentioning
confidence: 99%