2006 7th International Conference on Electronic Packaging Technology 2006 Help me understand this report
Solder Joint Thermal Fatigue Analysis of 48-FBGA
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Cited by 6 publications
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“…In the ANSYS calculation, an element table manipulation is used to generate the energy density in the post processing stage [10][11][12]. Since the solder under lead is very thin, the whole solder layer is selected to predict fatigue life.…”
Section: Resultsmentioning
confidence: 99%
“…In the ANSYS calculation, an element table manipulation is used to generate the energy density in the post processing stage [10][11][12]. Since the solder under lead is very thin, the whole solder layer is selected to predict fatigue life.…”
Section: Resultsmentioning
confidence: 99%
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