Effect and experiment of screw locations on BGA viscoplastic fatigue life

Tian, Wenchao; Rongcheng, Guan

doi:10.1109/icept.2014.6922711

Cited by 1 publication

(2 citation statements)

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“…Recently, many studies have been conducted on the changing mechanical design of PCB and the boundary conditions that improve the fatigue life of solder joints [8][9][10]. Doranga et al [8] compared the fatigue life of solder joints with different PCB thicknesses under vibration loading.…”

Section: Introductionmentioning

confidence: 99%

“…They found that the stiffness of the board increases as the fastening area increases, resulting in increased solder joint lifetime. Wenchao et al [10] investigated the change in the fatigue life of solder joints due to the locations of screw holes used to fix the PCB board under thermal cycling. The plastic strain of the solder joint for five different screw hole locations was calculated through simulations.…”

Section: Introductionmentioning

confidence: 99%

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Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration

Lee,

Jeong,

Jang

2024

Materials

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We investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stress, which are the main parameters influencing the fatigue life of solder joints under thermal cycling and random vibration, respectively. We analyzed the correlation between the screw hole position and the main parameters of the fatigue life through sensitivity analysis. By performing multi-objective optimization, we determined the screw hole position that maximizes the fatigue life of solder joints under thermal cycling and random vibration. With the optimal screw hole position, the fatigue life significantly increased under thermal cycling and random vibration compared to the BLR test board with the initial screw hole position.

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