Reliability behavior of lead-free solder joints in electronic components

Zhang, Liang; Han, Junyu; He, Chengwen; Guo, Yong-huan

doi:10.1007/s10854-012-0720-y

Cited by 58 publications

(17 citation statements)

References 106 publications

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“…The solution can reach equilibrium convergence at the end of the each load increment in force of some certain permissible range [11,12] . The results of this simulation and their discussions are presented and carried out respectively in three subdivisions.…”

Section: Resultsmentioning

confidence: 99%

The fatigue life analysis of conductive adhesive

Liu

Huang

2013

2013 14th International Conference on Electronic Packaging Technology

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Considering the influence of the cost, reliability and environment issues, the lead-free material of solder connection is paid more and more attention in integrated circuit packaging field. As the substitute of traditional solder, conductive adhesive has its own advantages. In this paper, a ball grid array (BGA) is chosen to illustrate the fatigue model for the methods of strain-based and energy-based life prediction. The strain analysis theory and the finite element analysis (FEM) simulation of fatigue life prediction are introduced in this paper. The conductive adhesive's failure mechanism of theoretical analysis is described. By means of finite element analysis, thermal stress simulation curve of conductive adhesive is analysed. The curve (s-n curve) of conductive adhesive fatigue life and load amplitude as well as fatigue sensitivity coefficient is given. And failure of life under different stress is predicted. Finally, the outlook of conductive adhesive connection reliability is also expounded.

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Section: Resultsmentioning

confidence: 99%

The fatigue life analysis of conductive adhesive

Liu

Huang

2013

2013 14th International Conference on Electronic Packaging Technology

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“…The quarter symmetric FEA model of the 3D IC was utilized because of the symmetry both in the geometry, which can reduce the computational time. The quarter models have been utilized in BGA, CSP, WLCSP and QFP devices successfully in finite element simulation to calculate the fatigue life of solder joints under thermal cycle loading [10][11][12] . The finite element model of the 3D IC is shown in Fig.1 (b), the model consists of chips, IMCs/Sn-3.9Ag-0.6Cu solder joints, TSV Cu pillars, BT substrate and Cu/Ni pads.…”

Section: Fem Analysismentioning

confidence: 99%

Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Zhang

Zhong²

2020

Preprint

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In this paper, the thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints were investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of different control factors, including high temperature, low temperature, dwell time of thermal cyclic loading, and different IMCs on the stress-strain response and fatigue life of solder joints were calculated respectively. The results indicate that maximum stress-strain can be found in the second solder joint on the diagonal of IMC solder joints array, for Sn-3.9Ag-0.6Cu solder joints array the corner solder joints shows the obvious maximum stress-strain, these areas are the crack propagated locations. The stress-strain and fatigue life of solder joints is more sensitive to dwell temperature, especially to high temperature, increasing the high temperature, dwell time, or decreasing the low temperature, can reduce the stress-strain and enlarge the fatigue life of solder joints. The optimal design in the 3D IC structure has the combination of the Cu6Sn5/Cu3Sn, 373K high temperature, 233K low temperature, and 10min dwell time.

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“…17,18 Also, designing for enhanced solder joint reliability is critical to long-lifetime electronic packages, because solder joints are prone to failure in the electronic package under various environmental conditions such as temperature, humidity, dust, shock, and vibration, making it important to evaluate solder joint reliability under harsh environmental conditions. 19,20 In this work, we demonstrate the effects of two surface finishes, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on epoxyenhanced Sn-58 wt.%Bi solder by means of boardlevel drop tests to evaluate the mechanical properties of the solder joints under constant temperature-humidity testing.…”

Section: Introductionmentioning

confidence: 99%

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung

Kim

et al. 2016

Journal of Elec Materi

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The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/ 85% RH storage condition, new IMCs were formed on the Ni 3 Sn 4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

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Reliability behavior of lead-free solder joints in electronic components

Cited by 58 publications

References 106 publications

The fatigue life analysis of conductive adhesive

The fatigue life analysis of conductive adhesive

Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

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